متابعة
SUSMRITI DAS MAHAPATRA
SUSMRITI DAS MAHAPATRA
Quality & Reliability R&D Engineer, Intel Corporation
بريد إلكتروني تم التحقق منه على intel.com - الصفحة الرئيسية
عنوان
عدد مرات الاقتباسات
عدد مرات الاقتباسات
السنة
Piezoelectric materials for energy harvesting and sensing applications: roadmap for future smart materials‏
SD Mahapatra, PC Mohapatra, AI Aria, G Christie, YK Mishra, S Hofmann, ...‏
Advanced Science 8 (17), 2100864, 2021‏
4512021
Recent advances in mitigation of whiskers from electroplated tin‏
BS Majumdar, I Dutta, S Bhassyvasantha, S Das Mahapatra‏
JOM 72, 906-917, 2020‏
152020
Co-electrodeposition of tin with 0.2–20% indium: Implications on tin whisker growth‏
SD Mahapatra, I Dutta‏
Surface and Coatings Technology 337, 478-483, 2018‏
102018
Elimination of Whisker Growth by Indium Addition in Electroplated Tin on Copper Substrate‏
SD Mahapatra‏
Washington State University, 2017‏
92017
Whisker mitigation mechanisms in indium-doped tin thin films: role of the surface‏
S Bhassyvasantha, N Fredj, SD Mahapatra, W Jennings, I Dutta, ...‏
Journal of Electronic Materials 47, 6229-6240, 2018‏
62018
Role of surface oxide in mitigating tin whisker growth: A finite element study‏
SD Mahapatra, I Dutta‏
Materials Science and Engineering: A 706, 181-191, 2017‏
52017
Controlling tin whisker growth via oxygen-mediated decomposition of Ti2SnC‏
H Tang, B Yan, P Zhang, X Yin, Z Tian, S Das Mahapatra, W Zheng, ...‏
Journal of Materials Science 59 (5), 1958-1967, 2024‏
42024
Eliminating whisker growth by indium addition in electroplated Sn on copper substrate‏
S Das Mahapatra, BS Majumdar, I Dutta, S Bhassyvasantha‏
Journal of Electronic Materials 46, 4062-4075, 2017‏
42017
Elimination of Tin Whisker Growth by Indium Addition to Electroplated Tin in Electronic Packages‏
BSMID S. Das Mahapatra‏
16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2017‏
42017
Influence of Indium Addition on Whisker Growth in Electroplated Sn‏
ID S. Das Mahapatra, H. Yang, L. Meinshausen, S. Bhassyvasantha, S Banerjee ...‏
The Ninth Pacific Rim International Conference on Advanced Materials and …, 2016‏
4*2016
Method of electroplating tin films with indium using an alkanesulfonic acid based electrolyte‏
I Dutta, SD Mahapatra‏
US Patent App. 15/654,291, 2017‏
22017
Chip-scale package architectures containing a die back side metal and a solder thermal interface material‏
SD Mahapatra, M Sankarasubramanian, S Howell, J Harper, M Modi‏
US Patent 12,040,246, 2024‏
12024
Solder Thermal Interface Material (STIM) with Dopant‏
PL Susmriti Das Mahapatra, Bamidele Falola, Amitesh Saha, Sergio Chan‏
US Patent App. 16/406,593, 2019‏
1*2019
Lids for Integrated Circuit Packages with Solder Thermal Interface Materials‏
PL Bamidele Falola, Susmriti Das Mahapatra, Amitesh Saha, Sergio Chan‏
US Patent App. 16/435,355, 2019‏
1*2019
Chip-scale package architectures containing a die back side metal and a solder thermal interface material‏
SD Mahapatra, M Sankarasubramanian, S Howell, J Harper, M Modi‏
US Patent App. 18/744,108, 2024‏
2024
يتعذر على النظام إجراء العملية في الوقت الحالي. عاود المحاولة لاحقًا.
مقالات 1–15