| Ultra-low precision 4-bit training of deep neural networks X Sun, N Wang, CY Chen, J Ni, A Agrawal, X Cui, S Venkataramani, ... Advances in Neural Information Processing Systems 33, 1796-1807, 2020 | 220 | 2020 |
| Scalecom: Scalable sparsified gradient compression for communication-efficient distributed training CY Chen, J Ni, S Lu, X Cui, PY Chen, X Sun, N Wang, S Venkataramani, ... Advances in Neural Information Processing Systems 33, 13551-13563, 2020 | 77 | 2020 |
| Mechanisms of electromigration damage in Cu interconnects CK Hu, L Gignac, G Lian, C Cabral, K Motoyama, H Shobha, J Demarest, ... 2018 IEEE International Electron Devices Meeting (IEDM), 5.2. 1-5.2. 4, 2018 | 22 | 2018 |
| Effect of microstructure on electromigration-induced stress AM Maniatty, J Ni, Y Liu, H Zhang Journal of Applied Mechanics 83 (1), 011010, 2016 | 12 | 2016 |
| Kaoutar El Maghraoui, Vijayalakshmi Srinivasan, and Kailash Gopalakrishnan. Ultra-low precision 4-bit training of deep neural networks X Sun, N Wang, CY Chen, J Ni, A Agrawal, X Cui, S Venkataramani NeurIPS, 2020 | 7 | 2020 |
| Modeling effect of grain orientation on degradation in tin-based solder: I. Current-driven diffusion Y Zhang, J Ni, Y Liu, AM Maniatty IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (3 …, 2018 | 4 | 2018 |
| Modeling microstructure effects on electromigration in lead-free solder joints J Ni, Y Liu, J Hao, A Maniatty, B O'Connell 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1241-1246, 2014 | 4 | 2014 |
| Modeling effect of grain orientation on degradation in tin-based solder—Part II: Electromigration experiments J Ni, M Ring, J Hao, Y Liu, AM Maniatty IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 3 | 2019 |
| CMOS-compatible wearable sensors fabricated using controlled spalling K Sakuma, H Hu, XH Liu, J Ni, SW Bedell, B Webb, SL Wright, P Lauro, ... IEEE Sensors Journal 19 (18), 7868-7874, 2019 | 3 | 2019 |
| Crystal plasticity finite element analysis of electromigration-induced deformation behavior in lead-free solder joints J Ni, A Maniatty, Y Liu, J Hao 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1023-1028, 2015 | 3 | 2015 |
| Modeling Microstructure Effects on Electromigration in Tin-Based Solder Bumps J Ni Rensselaer Polytechnic Institute, 2017 | 2 | 2017 |
| Four-bit training for machine learning X Sun, A Agrawal, K Gopalakrishnan, N Wang, CY Chen, J Ni US Patent App. 17/112,528, 2022 | 1 | 2022 |
| Electromigration Induced Stress in Lead-Free Solder Joints J Ni, A Maniatty, Y Liu, J Hao, M Ring 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 538-543, 2016 | 1 | 2016 |
