| Changes and challenges of photovoltaic inverter with silicon carbide device Z Zeng, W Shao, H Chen, B Hu, W Chen, H Li, L Ran Renewable and Sustainable Energy Reviews 78, 624-639, 2017 | 66 | 2017 |
| Mathematical model and strategic energy storage selection of virtual synchronous generators Z Zeng, W Shao, L Ran, Z Lv, R Li Automation of Electric Power Systems 39 (13), 22-31, 2015 | 57 | 2015 |
| A power module for grid inverter with in-built short-circuit fault current capability W Shao, R Wu, L Ran, H Jiang, PA Mawby, DJ Rogers, TC Green, ... IEEE Transactions on Power Electronics 35 (10), 10567-10579, 2020 | 48 | 2020 |
| Reconnection of micro‐grid from islanded mode to grid‐connected mode used sliding Goertzel transform based filter Z Zeng, W Shao IET Renewable Power Generation 11 (7), 1041-1048, 2017 | 32 | 2017 |
| Multi‐functional grid‐connected inverter: upgrading distributed generator with ancillary services Z Zeng, X Li, W Shao IET Renewable Power Generation 12 (7), 797-805, 2018 | 29 | 2018 |
| A phase change material integrated press pack power module with enhanced overcurrent capability for grid support—A study on FRD H Ren, W Shao, L Ran, G Hao, L Zhou, P Mawby, H Jiang IEEE Transactions on Industry Applications 57 (4), 3956-3968, 2021 | 21 | 2021 |
| Chances and challenges of photovoltaic inverters with silicon carbide devices Z Zheng, S Weihua, H Borong Proceedings of the CSEE 37 (1), 221-232, 2017 | 18 | 2017 |
| Estimation of inertia and damping for virtual synchronous generator based on linearized model Z Zheng, S Weihua Automation of Electric Power Systems 41 (10), 37-43, 2017 | 18 | 2017 |
| A ᐃTj Reduced Power Module With Inbuilt Phase Change Material for Reliability Enhancement H Jiang, J Wei, X Fang, H Ren, W Shao, L Ran IEEE Transactions on Electron Devices 68 (9), 4557-4564, 2021 | 17 | 2021 |
| Design and evaluation of SiC multichip power module with low and symmetrical inductance S Weihua, L Ran, Z Zheng, L Xiaoling, P Mawby The Journal of Engineering 2019 (17), 3573-3577, 2019 | 16 | 2019 |
| On-off behavior control of SiC MOSFET by gate drive loops Z Zheng, S Weihua, C Hao Proceedings of the CSEE 38 (4), 1165-1176, 2018 | 16 | 2018 |
| A fluxgate-based current sensor for DC bias elimination in a dual active bridge converter G Qiu, L Ran, H Feng, H Jiang, T Long, AJ Forsyth, WH Shao, X Hou IEEE Transactions on Power Electronics 37 (3), 3233-3246, 2021 | 12 | 2021 |
| Coordination control of multiple multi-functional grid-tied inverters to share power quality issues for grid-connected micro-grid Z Zheng, WH Shao, WF Zhao, L Ran, H Yang Proc. CSEE 35, 4947-4955, 2015 | 12 | 2015 |
| Comparative evaluations and failure modes of wire-bonding packaged sic, si, and hybrid power modules X Li, Z Zeng, H Chen, W Shao, L Ran 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2018 | 11 | 2018 |
| Thermal buffering effect of phase change material on press-pack IGBT during power pulse H Ren, G Hao, W Shao, L Ran, L Zhou, P Mawby, H Jiang 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 4937-4943, 2019 | 10 | 2019 |
| Power module with large short‐term current capability by using phase change material W Shao, L Ran, H Jiang, D Kastha, P Bajpai, R Wu, PA Mawby, Z Zeng The Journal of Engineering 2019 (16), 3225-3229, 2019 | 10 | 2019 |
| Enhanced over-current capability and extended SOA of power modules utilizing phase change material W Shao, R Wu, L Ran, H Jiang, T Coombs, K Yardley, P Mawby, D Kastha, ... 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 5315-5320, 2019 | 9 | 2019 |
| Reliability enhancement of power modules by restricting junction temperature fluctuation through increased transient thermal capacity X Fang, H Jiang, X Wang, W Shao, H Ren, L Ran, H Mao 2020 IEEE Energy Conversion Congress and Exposition (ECCE), 4024-4028, 2020 | 8 | 2020 |
| Power modules for pulsed power applications using phase change material W Shao, L Ran, Z Zeng, R Wu, P Mawby, J Huaping, D Kastha, P Bajpai 2018 Second International Symposium on 3D Power Electronics Integration and …, 2018 | 8 | 2018 |
| Novel cooling technology to reduce thermal impedance and thermomechanical stress for SiC application B Hu, Z Zeng, W Shao, Q Ma, H Ren, H Li, L Ran, Z Li 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 3063-3067, 2017 | 8 | 2017 |
Zheng ZengSchool of Electrical Engineering, Chongqing University, Chinaبريد إلكتروني تم التحقق منه على cqu.edu.cn