متابعة
Abhijit Dasgupta
Abhijit Dasgupta
Professor of Mechanical Engineering, University of Maryland
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عنوان
عدد مرات الاقتباسات
عدد مرات الاقتباسات
السنة
Solder creep-fatigue analysis by an energy-partitioning approach‏
A Dasgupta, C Oyan, D Barker, M Pecht‏
3021992
Material failure mechanisms and damage models‏
A Dasgupta, M Pecht‏
IEEE Transactions on Reliability 40 (5), 531-536, 1991‏
2851991
Physics-of-failure: an approach to reliable product development‏
M Pecht, A Dasgupta‏
Journal of the IES 38 (5), 30-34, 1995‏
2581995
Three-dimensional modeling of woven-fabric composites for effective thermo-mechanical and thermal properties‏
A Dasgupta, RK Agarwal, SM Bhandarkar‏
Composites science and technology 56 (3), 209-223, 1996‏
2571996
Orthotropic thermal conductivity of plain-weave fabric composites using a homogenization technique‏
A Dasgupta, RK Agarwal‏
Journal of composite materials 26 (18), 2736-2758, 1992‏
2081992
Ultrasound-mediated drug delivery to the brain: principles, progress and prospects‏
A Dasgupta, M Liu, T Ojha, G Storm, F Kiessling, T Lammers‏
Drug Discovery Today: Technologies 20, 41-48, 2016‏
1802016
Role of failure-mechanism identification in accelerated testing‏
J Hu, D Barker, A Dasgupta, A Arora‏
Journal of the IES 36 (4), 39-45, 1993‏
1511993
Fibrosis imaging: current concepts and future directions‏
M Baues, A Dasgupta, J Ehling, J Prakash, P Boor, F Tacke, F Kiessling, ...‏
Advanced drug delivery reviews 121, 9-26, 2017‏
1422017
A fundamental overview of accelerated testing analytical models‏
H Caruso, A Dasgupta‏
Journal of the IEST 41 (1), 16-20, 1998‏
1281998
Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3. 9Ag0. 6Cu solder alloy‏
Q Zhang, A Dasgupta, P Haswell‏
53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003‏
1162003
Failure-mechanism models for creep and creep rupture‏
J Li, A Dasgupta‏
IEEE Transactions on Reliability 42 (3), 339-353, 1993‏
1161993
The reliability physics approach to failure prediction modelling‏
M Pecht, A Dasgupta, D Barker, CT Leonard‏
Quality and Reliability Engineering International 6 (4), 267-273, 1990‏
1091990
Quality conformance and qualification of microelectronic packages and interconnects‏
MG Pecht, A Dasgupta, JW Evans, JY Evans‏
John Wiley & Sons, 1994‏
1061994
Combined vibrational and thermal solder joint fatigue—A generalized strain versus life approach‏
D Barker, J Vodzak, A Dasgupta, M Pecht‏
1041990
PWB solder joint life calculations under thermal and vibrational loading‏
D Barker, A Dasgupta, M Peeht‏
Journal of the IES 35 (1), 17-25, 1992‏
1031992
Large-scale model test on square box culvert backfilled with sand‏
A Dasgupta, B Sengupta‏
Journal of Geotechnical Engineering 117 (1), 156-161, 1991‏
1001991
Mechanistic model for the stress-strain response of double-layered PSA‏
H Huang, A Dasgupta‏
2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018‏
942018
Systematic study on thermo-mechanical durability of Pb-free assemblies: Experiments and FE analysis‏
Q Zhang, A Dasgupta, D Nelson, H Pallavicini‏
892005
PBCA-based polymeric microbubbles for molecular imaging and drug delivery‏
P Koczera, L Appold, Y Shi, M Liu, A Dasgupta, V Pathak, T Ojha, ...‏
Journal of controlled release 259, 128-135, 2017‏
862017
Effective thermomechanical behavior of plain-weave fabric-reinforced composites using homogenization theory‏
A Dasgupta, SM Bhandarkar‏
861994
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مقالات 1–20