| Phonon scattering in silicon films with thickness of order 100 nm YS Ju, KE Goodson Applied Physics Letters 74 (20), 3005-3007, 1999 | 898 | 1999 |
| Highly efficient electrocaloric cooling with electrostatic actuation R Ma, Z Zhang, K Tong, D Huber, R Kornbluh, YS Ju, Q Pei Science 357 (6356), 1130-1134, 2017 | 414 | 2017 |
| Heat conduction in novel electronic films KE Goodson, YS Ju Annual Review of Materials Science 29 (1), 261-293, 1999 | 256 | 1999 |
| Sub-continuum simulations of heat conduction in silicon-on-insulator transistors PG Sverdrup, Y Sungtaek Ju, KE Goodson J. Heat Transfer 123 (1), 130-137, 2001 | 247 | 2001 |
| Fabrication and characterization of the capillary performance of superhydrophilic Cu micropost arrays Y Nam, S Sharratt, C Byon, SJ Kim, YS Ju Journal of Microelectromechanical Systems 19 (3), 581-588, 2010 | 227 | 2010 |
| Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage BW Chui, TD Stowe, YS Ju, KE Goodson, TW Kenny, HJ Mamin, BD Terris, ... Journal of Microelectromechanical Systems 7 (1), 69-78, 1998 | 224 | 1998 |
| A solid-state refrigerator based on the electrocaloric effect Y Jia, Y Sungtaek Ju Applied Physics Letters 100 (24), 2012 | 220 | 2012 |
| Heat conduction in graphite-nanoplatelet-reinforced polymer nanocomposites MT Hung, O Choi, YS Ju, HT Hahn Applied Physics Letters 89 (2), 2006 | 212 | 2006 |
| A comparative study of the morphology and wetting characteristics of micro/nanostructured Cu surfaces for phase change heat transfer applications Y Nam, YS Ju Journal of Adhesion Science and Technology 27 (20), 2163-2176, 2013 | 198 | 2013 |
| Phonon heat transport in silicon nanostructures YS Ju Applied Physics Letters 87 (15), 2005 | 178 | 2005 |
| Experimental and numerical study of single bubble dynamics on a hydrophobic surface Y Nam, J Wu, G Warrier, YS Ju | 174 | 2009 |
| Single bubble dynamics on a superhydrophilic surface with artificial nucleation sites Y Nam, E Aktinol, VK Dhir, YS Ju International Journal of Heat and Mass Transfer 54 (7-8), 1572-1577, 2011 | 165 | 2011 |
| Multi-artery heat pipe spreader: experiment GS Hwang, Y Nam, E Fleming, P Dussinger, YS Ju, M Kaviany International Journal of Heat and Mass Transfer 53 (13-14), 2662-2669, 2010 | 160 | 2010 |
| Planar vapor chamber with hybrid evaporator wicks for the thermal management of high-heat-flux and high-power optoelectronic devices YS Ju, M Kaviany, Y Nam, S Sharratt, GS Hwang, I Catton, E Fleming, ... International Journal of Heat and Mass Transfer 60, 163-169, 2013 | 153 | 2013 |
| Thermal characterization of anisotropic thin dielectric films using harmonic Joule heating YS Ju, K Kurabayashi, KE Goodson Thin Solid Films 339 (1-2), 160-164, 1999 | 142 | 1999 |
| Characterization and modeling of the heat transfer performance of nanostructured Cu micropost wicks Y Nam, S Sharratt, G Cha, YS Ju | 136 | 2011 |
| Solid-state refrigeration based on the electrocaloric effect for electronics cooling YS Ju | 112 | 2010 |
| Multi-artery heat-pipe spreader: Lateral liquid supply GS Hwang, E Fleming, B Carne, S Sharratt, Y Nam, P Dussinger, YS Ju, ... International Journal of Heat and Mass Transfer 54 (11-12), 2334-2340, 2011 | 103 | 2011 |
| Bubble nucleation on hydrophobic islands provides evidence to anomalously high contact angles of nanobubbles Y Nam, YS Ju Applied Physics Letters 93 (10), 2008 | 102 | 2008 |
| Low-resistance high-magnetoresistance magnetic tunnel junction device with improved tunnel barrier MJ Carey, BA Gurney, Y Ju US Patent 6,756,128, 2004 | 100 | 2004 |
