| Electrospinning of polymer nanofibers: Effects on oriented morphology, structures and tensile properties A Baji, YW Mai, SC Wong, M Abtahi, P Chen Composites science and technology 70 (5), 703-718, 2010 | 1175 | 2010 |
| A predictive model of grinding force in silicon wafer self-rotating grinding J Sun, F Qin, P Chen, T An International Journal of Machine Tools and Manufacture 109, 74-86, 2016 | 96 | 2016 |
| Fabrication of PVDF/PVA microtubules by coaxial electrospinning H Na, P Chen, SC Wong, S Hague, Q Li Polymer 53 (13), 2736-2743, 2012 | 86 | 2012 |
| Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process L Zhang, P Chen, T An, Y Dai, F Qin Current Applied Physics 19 (5), 570-581, 2019 | 71 | 2019 |
| Do electrospun polymer fibers stick? Q Shi, KT Wan, SC Wong, P Chen, TA Blackledge Langmuir 26 (17), 14188-14193, 2010 | 63 | 2010 |
| Modelling and experimental study of roughness in silicon wafer self-rotating grinding J Sun, P Chen, F Qin, T An, H Yu, B He Precision Engineering 51, 625-637, 2018 | 47 | 2018 |
| Measurement of adhesion work of electrospun polymer membrane by shaft-loaded blister test H Na, P Chen, KT Wan, SC Wong, Q Li, Z Ma Langmuir 28 (16), 6677-6683, 2012 | 42 | 2012 |
| A lifetime prediction method for IGBT modules considering the self-accelerating effect of bond wire damage F Qin, X Bie, T An, J Dai, Y Dai, P Chen IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (2 …, 2020 | 41 | 2020 |
| Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests T An, C Fang, F Qin, H Li, T Tang, P Chen Microelectronics Reliability 91, 213-226, 2018 | 39 | 2018 |
| Vibration lifetime estimation of PBGA solder joints using Steinberg model T An, F Qin, B Zhou, P Chen, Y Dai, H Li, T Tang Microelectronics Reliability 102, 113474, 2019 | 36 | 2019 |
| Direct joining of quartz glass and copper by nanosecond laser Y Feng, R Pan, T Zhou, Z Dong, Z Yan, Y Wang, P Chen, S Chen Ceramics International 49 (22), 36056-36070, 2023 | 35 | 2023 |
| Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading Y Dai, M Zhang, F Qin, P Chen, T An Engineering Fracture Mechanics 209, 274-300, 2019 | 32 | 2019 |
| Temperature and grain size dependences of mechanical properties of nanocrystalline copper by molecular dynamics simulation P Chen, Z Zhang, C Liu, T An, H Yu, F Qin Modelling and Simulation in Materials Science and Engineering 27 (6), 065012, 2019 | 31 | 2019 |
| A study on the effect of microstructure evolution of the aluminum metallization layer on its electrical performance during power cycling J Zhao, T An, C Fang, X Bie, F Qin, P Chen, Y Dai IEEE transactions on power electronics 34 (11), 11036-11045, 2019 | 30 | 2019 |
| Protrusion of electroplated copper filled in through silicon vias during annealing process S Chen, F Qin, T An, P Chen, B Xie, X Shi Microelectronics Reliability 63, 183-193, 2016 | 30 | 2016 |
| On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters S Zhao, Y Dai, F Qin, Y Li, L Liu, Z Zan, T An, P Chen, Y Gong, Y Wang Materials Science and Engineering: A 823, 141729, 2021 | 25 | 2021 |
| In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process F Qin, L Zhang, P Chen, T An, Y Dai, Y Gong, Z Yi, H Wang Mechanical Systems and Signal Processing 154, 107550, 2021 | 24 | 2021 |
| Generation and distribution of residual stress during nano-grinding of monocrystalline silicon P Chen, Z Zhang, T An, H Yu, F Qin Japanese Journal of Applied Physics 57 (12), 121302, 2018 | 24 | 2018 |
| The effect of the diffusion creep behavior on the TSV-Cu protrusion morphology during annealing T An, F Qin, S Chen, P Chen Journal of Materials Science: Materials in Electronics 29, 16305-16316, 2018 | 22 | 2018 |
| Evaluation of thermal conductivity for sintered silver considering aging effect with microstructure based model F Qin, Y Hu, Y Dai, T An, P Chen Microelectronics Reliability 108, 113633, 2020 | 20 | 2020 |
Yanwei DaiBeijing University of Technologyبريد إلكتروني تم التحقق منه على bjut.edu.cn
