| Creep measurements of 200 μm-400 μm solder joints M Rollig, S Wiese, K Meier, KJ Wolter 2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007 | 27 | 2007 |
| The influence of size and composition on the creep of SnAgCu solder joints S Wiese, M Roellig, M Mueller, S Rzepka, K Nocke, C Luhmann, ... 2006 1st Electronic Systemintegration Technology Conference 2, 912-925, 2006 | 21 | 2006 |
| Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading K Meier, M Roellig, A Schiessl, KJ Wolter 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014 | 18 | 2014 |
| Life time prediction for lead-free solder joints under vibration loads K Meier, M Roellig, A Schiessl, KJ Wolter 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011 | 18 | 2011 |
| Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics R Metasch, M Roellig, A Kabakchiev, B Metais, R Ratchev, K Meier, ... 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014 | 15 | 2014 |
| Characterization methods for determination of temperature depended electrical, thermal, mechanical and fatigue properties of SnAg3. 5 solder M Roellig, R Metasch, K Meier, F Alt 3rd Electronics System Integration Technology Conference ESTC, 1-11, 2010 | 14 | 2010 |
| Reliability of 3D additive manufactured packages S Lüngen, T Tiedje, K Meier, K Nieweglowski, K Bock 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-5, 2018 | 12 | 2018 |
| Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly K Meier, R Metasch, M Roellig, K Bock Microelectronics Reliability 87, 125-132, 2018 | 12 | 2018 |
| Finite element modeling on thermal fatigue of BGA solder joints with multiple voids R Schwerz, S Meyer, M Roellig, K Meier, KJ Wolter Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011 | 12 | 2011 |
| Low temperature vibration reliability of lead-free solder joints K Meier, M Ochmann, K Bock, D Leslie, A Dasgupta 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 801-806, 2020 | 11 | 2020 |
| Impact of warpage effects on quality and reliability of solder joints O Albrecht, H Wohlrabe, K Meier 2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2019 | 11 | 2019 |
| Creep measurements on SnAgCu solder joints in different compositions and after mechanical and thermal treatment M Rollig, S Wiese, K Meier, KJ Wolter EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008 | 11 | 2008 |
| Thermo-mechanical characterization and modeling of TSV annealing behavior P Saettler, D Kovalenko, K Meier, M Roellig, M Boettcher, KJ Wolter 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012 | 10 | 2012 |
| Analysis of flip-chip solder joints under isothermal vibration loading K Meier, D Leslie, A Dasgupta, M Roellig, K Bock 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 138-142, 2019 | 9 | 2019 |
| Fatigue behaviour of lead-free solder joints under combined thermal and vibration loads K Meier, M Winkler, D Leslie, A Dasgupta, K Bock 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 498-504, 2019 | 9 | 2019 |
| Experimental determination of the Young's modulus of copper and solder materials for electronic packaging F Kraemer, M Roellig, R Metasch, J Ahmar, K Meier, S Wiese Microelectronics Reliability 91, 251-256, 2018 | 9 | 2018 |
| Lifetime assessment for bipolar components under vibration and temperature loading K Meier, M Roellig, G Lautenschlaeger, A Schiessl, KJ Wolter 2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013 | 9 | 2013 |
| Characterisation of the mechanical behaviour of SAC solder at high strain rates K Meier, M Roellig, S Wiese, KJ Wolter 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and …, 2010 | 9 | 2010 |
| Improved damage modeling for solder joints under combined vibration and temperature cycling loading R Höhne, K Meier, A Dasgupta, D Leslie, KH Bock 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1353-1358, 2021 | 8 | 2021 |
| Mechanical behaviour of typical lead-free solders at high strain rate conditions K Meier, M Roellig, S Wiese, KJ Wolter 2010 12th Electronics Packaging Technology Conference, 825-831, 2010 | 8 | 2010 |
