| Thermal conductivity of amorphous SiO2 thin film: A molecular dynamics study W Zhu, G Zheng, S Cao, H He Scientific reports 8 (1), 10537, 2018 | 166 | 2018 |
| Quantifying multiscale habitat structural complexity: a cost-effective framework for underwater 3D modelling R Ferrari, D McKinnon, H He, RN Smith, P Corke, M González-Rivero, ... Remote Sensing 8 (2), 113, 2016 | 113 | 2016 |
| An effective and efficient numerical method for thermal management in 3D stacked integrated circuits C Xiao, H He, J Li, S Cao, W Zhu Applied Thermal Engineering 121, 200-209, 2017 | 66 | 2017 |
| Dispensing of high concentration Ag nano-particles ink for ultra-low resistivity paper-based writing electronics F Wang, P Mao, H He Scientific reports 6 (1), 21398, 2016 | 64 | 2016 |
| Mosaicking of unmanned aerial vehicle imagery in the absence of camera poses Y Xu, J Ou, H He, X Zhang, J Mills Remote Sensing 8 (3), 204, 2016 | 63 | 2016 |
| The soft-landing features of a micro-magnetorheological fluid damper J Li, W Wang, Y Xia, H He, W Zhu Applied Physics Letters 106 (1), 2015 | 57 | 2015 |
| Unaided stereo vision based pose estimation M Warren, D McKinnon, H He, B Upcroft Proceedings of the 2010 Australasian Conference on Robotics and Automation, 1-8, 2010 | 56 | 2010 |
| Structural design and control of a small-MRF damper under 50 N soft-landing applications J Li, D Wang, J Duan, H He, Y Xia, W Zhu IEEE Transactions on Industrial Informatics 11 (3), 612-619, 2015 | 55 | 2015 |
| Numerical optimization on microchannel flow and heat transfer performance based on field synergy principle F Li, W Zhu, H He International Journal of Heat and Mass Transfer 130, 375-385, 2019 | 54 | 2019 |
| Nonparametric semantic segmentation for 3D street scenes H He, B Upcroft 2013 IEEE/RSJ international conference on intelligent robots and systems …, 2013 | 52 | 2013 |
| Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging Y Pan, F Li, H He, J Li, W Zhu Microelectronics Reliability 70, 97-102, 2017 | 49 | 2017 |
| Effect of ultrasound on copper filling of high aspect ratio through-silicon via (TSV) H Xiao, F Wang, Y Wang, H He, W Zhu Journal of The Electrochemical Society 164 (4), D126, 2017 | 45 | 2017 |
| Field synergy analysis on flow and heat transfer characteristics of nanofluid in microchannel with non-uniform cavities configuration F Li, W Zhu, H He International Journal of Heat and Mass Transfer 144, 118617, 2019 | 43 | 2019 |
| Thermal boundary resistance measurement and analysis across SiC/SiO2 interface S Deng, C Xiao, J Yuan, D Ma, J Li, N Yang, H He Applied Physics Letters 115 (10), 2019 | 42 | 2019 |
| Monocular vision based autonomous navigation for a cost-effective MAV in GPS-denied environments I Sa, H He, V Huynh, P Corke 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics …, 2013 | 42 | 2013 |
| Towards automated and in-situ, near-real time 3-D reconstruction of coral reef environments D McKinnon, H He, B Upcroft, RN Smith OCEANS'11 MTS/IEEE KONA, 1-10, 2011 | 41 | 2011 |
| Large scale monocular vision-only mapping from a fixed-wing sUAS M Warren, D McKinnon, H He, A Glover, M Shiel, B Upcroft | 39 | 2012 |
| Numerical modeling and experimental verification of copper electrodeposition for through silicon via (TSV) with additives H Xiao, H He, X Ren, P Zeng, F Wang Microelectronic Engineering 170, 54-58, 2017 | 33 | 2017 |
| Effects of applied potential and the initial gap between electrodes on localized electrochemical deposition of micrometer copper columns F Wang, H Xiao, H He Scientific reports 6 (1), 26270, 2016 | 32 | 2016 |
| A simple and cost-effective method for improving the sensitivity of flexible strain sensors based on conductive polymer composites D Guo, X Pan, H He Sensors and Actuators A: Physical 298, 111608, 2019 | 29 | 2019 |
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