Bridge percolation: electrical connectivity of discontinued conducting slabs by metallic nanowires A Baret, L Bardet, D Oser, DP Langley, F Balty, D Bellet, ND Nguyen Nanoscale 16 (17), 8361-8368, 2024 | 3 | 2024 |
Insight into the morphological instability of metallic nanowires under thermal stress F Balty, A Baret, A Silhanek, ND Nguyen Journal of Colloid and Interface Science 673, 574-582, 2024 | 1 | 2024 |
Correlation between Material Properties, Crystalline Transitions, and Point Defects in RF Sputtered (N, Mg)-Doped Copper Oxide Thin Films T Ratz, E Fourneau, N Sliti, C Malherbe, A Baret, B Vertruyen, ... ACS Applied Electronic Materials, 2025 | | 2025 |
Low-emissivity fine-tuning of efficient VO 2-based thermochromic stacks with silver nanowire networks A Baret, A Khan, A Rougier, D Bellet, ND Nguyen RSC Applied Interfaces 2 (1), 94-103, 2025 | | 2025 |