| Phonon transport across GaN-diamond interface: The nontrivial role of pre-interface vacancy-phonon scattering C Yang, J Wang, D Ma, Z Li, Z He, L Liu, Z Fu, JY Yang International Journal of Heat and Mass Transfer 214, 124433, 2023 | 10 | 2023 |
| Thermal transport across TiO2–H2O interface involving water dissociation: Ab initio-assisted deep potential molecular dynamics Z Li, J Wang, C Yang, L Liu, JY Yang The Journal of Chemical Physics 159 (14), 2023 | 8 | 2023 |
| Integration of Heterogeneous Interfaces and Multi‐Dimensional Encapsulation Structure in Fe2N@CNTs Enabling Highly Efficient Thermal Management and … J Wang, Z Miao, K Gao, Z Li, X Zhang, C Yang, S Iqbal, G Xiang, A Cui, ... Advanced Functional Materials 34 (48), 2408696, 2024 | 7 | 2024 |
| Active learning molecular dynamics-assisted insights into ultralow thermal conductivity of two-dimensional covalent organic frameworks Z Li, H Dong, J Wang, L Liu, JY Yang International Journal of Heat and Mass Transfer 225, 125404, 2024 | 7 | 2024 |
| Degradation evaluation and defects analysis for 1.2-kV planar-gate SiC MOSFETs under repetitive surge current stress D Ma, Z He, Y Chen, Y Shi, J Wang, C Yang, M Zhang, Y Shen, L He, ... IEEE Transactions on Electron Devices 70 (12), 6473-6479, 2023 | 7 | 2023 |
| Magnetically Oriented 3D-Boron Nitride Nanobars Enable Efficient Heat Dissipation for 3D-Integrated Power Packaging J Wang, C Yang, D Ma, M Zhang, X Li, Z Li, Z He, L Liu, Z Fu, JY Yang ACS Applied Nano Materials 6 (19), 18508-18517, 2023 | 4 | 2023 |
| Atomistic insight into the device engineering of inorganic halide perovskite solar cells S Iqbal, X Duan, J Wang, L Liu, JY Yang Results in Engineering 24, 103105, 2024 | 3 | 2024 |
| Mechanistic insights into water filling effects on thermal transport of carbon nanotubes from machine learning molecular dynamics Z Li, J Wang, H Dong, Y Zhou, L Liu, JY Yang International Journal of Heat and Mass Transfer 235, 126152, 2024 | 1 | 2024 |
| Phonon transport across rough AlGaN/GaN interfaces with varying Al–Ga atomic ratios C Yang, J Wang, Z Li, L Liu, Z Fu, JY Yang Applied Physics Letters 124 (6), 2024 | 1 | 2024 |
| High‐Temperature Degradation Mechanism of Interfacial Thermal Resistance Based on Submicron Silver Adhesion J Wang, Z Fu, H Zhao, Z Li, D Ma, C Yang, Z He, X Guo, X Yang, S Chen, ... Advanced Materials Interfaces 10 (4), 2202017, 2023 | 1 | 2023 |
| Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing Z Fu, J Chen, P Zhao, X Guo, Q Xiao, X Fu, J Wang, C Yang, J Xu, ... Materials 16 (3), 1134, 2023 | 1 | 2023 |
| Intrinsic carrier transport and optical properties of lead-free inorganic halide double perovskites from first-principles S Iqbal, X Duan, J Wang, T Cheng, Z Li, J Tang, L Liu, JY Yang Materials Science in Semiconductor Processing 188, 109264, 2025 | | 2025 |
| Effect of wall contact angle on the conjugate heat transfer for flow boiling processes in rectangular microchannels J Wang, Z Li, H Yu, L Liu, GM Xiang, JY Yang Physics of Fluids 36 (11), 2024 | | 2024 |
| The Effect of Pore Defects on the Interfacial Thermal Resistance of GaN-Diamond Heterostructure C Yang, P Zhao, J Wang, D Ma, Z He, Z Fu, JY Yang 2023 24th International Conference on Electronic Packaging Technology (ICEPT …, 2023 | | 2023 |
| Effects of Porosity on Thermal Resistance Aging at Submicron Silver Interfaces J Wang, M Zhang, C Yang, Z He, Z Fu, JY Yang 2023 24th International Conference on Electronic Packaging Technology (ICEPT …, 2023 | | 2023 |
| Influence of Temperature and Current Stressing on Cu‐Sn Intermetallic Compound Growth Characteristics of Lead‐Free Microbump Z Fu, Q Wei, X Guo, X Fu, J Wang, C Yang, H Guo, JY Yang Advanced Theory and Simulations 6 (4), 2200881, 2023 | | 2023 |
| High Speed Transient Thermal Simulation of GaN HEMT Devices J Wang, R Wang, Z He, C Yang, Z Fu, JY Yang 2022 23rd International Conference on Electronic Packaging Technology (ICEPT …, 2022 | | 2022 |
