| Shear strength and fracture analysis of Sn-9Zn-2.5 Bi-1.5 In and Sn-3.0 Ag-0.5 Cu pastes with Cu-substrate joints under different reflow times S Gong, G Chen, S Qu, A Ren, V Duk, Q Shi, G Zhang Microelectronics Reliability 127, 114378, 2021 | 14 | 2021 |
| Microstructure evolution and mechanical properties of Sn-9Zn-2.5 Bi-1.5 In solder joints with aging treatment under various conditions S Gong, G Chen, S Qu, X Xu, V Duk, Q Shi, G Zhang Materials Characterization 205, 113319, 2023 | 11 | 2023 |
| Effect of temperature on joint quality in wave soldering of Sn-9Zn-2.5 Bi-1.5 In lead-free solder alloy V Duk, A Ren, G Zhang Microelectronic Engineering 292, 112229, 2024 | 2 | 2024 |
| Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints S Gong, G Chen, S Qu, V Duk, X Xu, Q Shi, G Zhang Journal of Materials Science: Materials in Electronics 35 (11), 750, 2024 | 1 | 2024 |
| Effect of Temperature on Joints Quality in Wave Soldering of Sn-9zn-2.5 bi-1.5 in Alloy DUK Vichea, G ZHANG, A REN Available at SSRN 4696427, 0 | | |