| Bonded structures with integrated passive component B Haba, I Mohammed, R Katkar, GZ Guevara, JA Delacruz, S Huang, ... US Patent 11,626,363, 2023 | 145 | 2023 |
| Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics G Gao, GG Fountain Jr, LW Mirkarimi, R Katkar, I Mohammed, CE Uzoh US Patent 11,011,494, 2021 | 145 | 2021 |
| Large metal pads over TSV G Gao, LEE Bongsub, GG Fountain Jr, CE Uzoh, LW Mirkarimi, B Haba, ... US Patent 11,393,779, 2022 | 140 | 2022 |
| Bonded structures PM Enquist, L Wang, R Katkar, JA Delacruz, AR Sitaram US Patent 10,522,499, 2019 | 138 | 2019 |
| Multichip modules and methods of fabrication L Wang, R Katkar, H Shen US Patent 9,666,559, 2017 | 137 | 2017 |
| Direct-bonded lamination for improved image clarity in optical devices B Haba, R Katkar, I Mohammed US Patent 11,256,004, 2022 | 134 | 2022 |
| Image sensor device R Katkar US Patent 9,899,442, 2018 | 134 | 2018 |
| Bonded structures L Wang, R Katkar, JA Delacruz, AR Sitaram US Patent 10,002,844, 2018 | 133 | 2018 |
| Protective elements for bonded structures JA Delacruz, B Haba, R Katkar US Patent 11,373,963, 2022 | 130 | 2022 |
| Cavity packages S Huang, JA Delacruz, L Wang, R Katkar, B Haba US Patent 10,923,408, 2021 | 130 | 2021 |
| Bonded structures R Katkar, L Wang US Patent 11,380,597, 2022 | 128 | 2022 |
| Wafer-level bonding of obstructive elements JA Delacruz, R Katkar US Patent 11,205,625, 2021 | 128 | 2021 |
| Bonded structures R Katkar, LW Mirkarimi, LEE Bongsub, GG Fountain Jr, CE Uzoh US Patent 11,004,757, 2021 | 128 | 2021 |
| Bonded structures without intervening adhesive B Haba, R Katkar, I Mohammed, JA Delacruz US Patent 11,476,213, 2022 | 123 | 2022 |
| Protective elements for bonded structures including an obstructive element B Haba, JA Delacruz, R Katkar, A Sitaram US Patent 11,610,846, 2023 | 122 | 2023 |
| Seal for microelectronic assembly R Katkar, L Wang, CE Uzoh, S Huang, G Gao, I Mohammed US Patent 10,508,030, 2019 | 122 | 2019 |
| Direct-bonded optoelectronic interconnect for high-density integrated photonics L Wang, R Katkar US Patent 11,011,503, 2021 | 121 | 2021 |
| Sealed bonded structures and methods for forming the same R Katkar, AR Sitaram, LW Mirkarimi US Patent App. 16/839,756, 2020 | 115 | 2020 |
| Diffusion barrier collar for interconnects R Katkar, CE Uzoh US Patent 11,031,285, 2021 | 113 | 2021 |
| Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive B Haba, LW Mirkarimi, JA Delacruz, R Katkar, CE Uzoh, G Gao, ... US Patent 12,080,672, 2024 | 112 | 2024 |
Belgacem HabaAdeia, Google, Tessera, SiPipe, Rambus, NEC, IBM, Stanford University, USTHBCorreu electrònic verificat a alumni.stanford.edu
