| Liquid metal patterning and unique properties for next‐generation soft electronics M Kim, H Lim, SH Ko Advanced Science 10 (6), 2205795, 2023 | 66 | 2023 |
| Functional materials and innovative strategies for wearable thermal management applications Y Jung, M Kim, T Kim, J Ahn, J Lee, SH Ko Nano-Micro Letters 15 (1), 160, 2023 | 55 | 2023 |
| Nanowire-assisted freestanding liquid metal thin-film patterns for highly stretchable electrodes on 3D surfaces M Kim, C Cho, W Shin, JJ Park, J Kim, P Won, C Majidi, SH Ko npj Flexible Electronics 6 (1), 99, 2022 | 40 | 2022 |
| Monolithically Programmed Stretchable Conductor by Laser‐Induced Entanglement of Liquid Metal and Metallic Nanowire Backbone C Cho, W Shin, M Kim, J Bang, P Won, S Hong, SH Ko Small 18 (37), 2202841, 2022 | 38 | 2022 |
| High heat storing and thermally diffusive artificial skin for wearable thermal management Y Jung, I Ha, M Kim, J Ahn, J Lee, SH Ko Nano Energy 105, 107979, 2023 | 35 | 2023 |
| Liquid metal based stretchable room temperature soldering sticker patch for stretchable electronics integration M Kim, JJ Park, C Cho, SH Ko Advanced Functional Materials 33 (36), 2303286, 2023 | 31 | 2023 |
| Strain-insensitive outdoor wearable electronics by thermally robust nanofibrous radiative cooler Y Jung, M Kim, S Jeong, S Hong, SH Ko ACS nano 18 (3), 2312-2324, 2024 | 25 | 2024 |
| Reconfigurable multilevel optical PUF by spatiotemporally programmed crystallization of supersaturated solution Y Kim, J Lim, JH Lim, E Hwang, H Lee, M Kim, I Ha, H Cho, J Kwon, J Oh, ... Advanced Materials 35 (22), 2212294, 2023 | 23 | 2023 |
| Reversible, Selective, Ultrawide‐Range Variable Stiffness Control by Spatial Micro‐Water Molecule Manipulation I Ha, M Kim, KK Kim, S Hong, H Cho, J Kwon, S Han, Y Yoon, P Won, ... Advanced Science 8 (20), 2102536, 2021 | 10 | 2021 |
| A Gradient Stiffness‐Programmed Circuit Board by Spatially Controlled Phase‐Transition of Supercooled Hydrogel for Stretchable Electronics Integration M Kim, S Hong, JJ Park, Y Jung, SH Choi, C Cho, I Ha, P Won, C Majidi, ... Advanced Materials 36 (25), 2313344, 2024 | 9 | 2024 |
| MXene-Enhanced Ionovoltaic Effect by Evaporation and Water Infiltration in Semiconductor Nanochannels H Park, G Choi, S Yoon, Y Jung, J Bang, M Kim, SH Ko ACS nano 18 (20), 13130-13140, 2024 | 1 | 2024 |
| Laser‐Based Fabrication Process Development for Flexible and Stretchable Electronics JJ Park, M Kim, SH Ko Mechanics of Flexible and Stretchable Electronics, 207-234, 2024 | | 2024 |
| Monolithically stacked VIA-free liquid metal circuit for stretchable electronics M Kim, JJ Park, S Hong, Y Jung, J Bang, C Cho, SH Ko Materials Today, 2024 | | 2024 |
| A Gradient Stiffness‐Programmed Circuit Board by Spatially Controlled Phase‐Transition of Supercooled Hydrogel for Stretchable Electronics Integration (Adv. Mater. 25/2024) M Kim, S Hong, JJ Park, Y Jung, SH Choi, C Cho, I Ha, P Won, C Majidi, ... Advanced Materials 36 (25), 2470189, 2024 | | 2024 |
| Heating plate and substrate processing apparatus including the same C Cho, KO Seunghwan, S Wooseop, M Kim, OH Kyoungwhan US Patent App. 18/306,570, 2024 | | 2024 |
| Laser treatment for creating a substrate-free liquid metal and its various applications M Kim, SH Ko Laser-based Micro-and Nanoprocessing XVIII, PC1287309, 2024 | | 2024 |
| Liquid Metal based Stretchable Room Temperature Soldering Sticker Patch for Stretchable Electronics Integration (Adv. Funct. Mater. 36/2023). M Kim, JJ Park, C Cho, SH Ko Advanced Functional Materials 33 (36), 2023 | | 2023 |
| Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics (Adv. Sci. 6/2023) M Kim, H Lim, SH Ko Advanced Science 10 (6), 2370033, 2023 | | 2023 |
Seung Hwan KoSeoul National UniversityCorreu electrònic verificat a snu.ac.kr
