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| Blind inpainting using the fully convolutional neural network N Cai, Z Su, Z Lin, H Wang, Z Yang, BWK Ling The Visual Computer 33, 249-261, 2017 | 127 | 2017 |
| Image denoising method based on a deep convolution neural network F Zhang, N Cai, J Wu, G Cen, H Wang, X Chen IET Image Processing 12 (4), 485-493, 2018 | 112 | 2018 |
| Wearable flexible strain sensor based on three-dimensional wavy laser-induced graphene and silicone rubber L Huang, H Wang, P Wu, W Huang, W Gao, F Fang, N Cai, R Chen, Z Zhu Sensors 20 (15), 4266, 2020 | 84 | 2020 |
| SMT solder joint inspection via a novel cascaded convolutional neural network N Cai, G Cen, J Wu, F Li, H Wang, X Chen IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (4 …, 2018 | 84 | 2018 |
| Fabrication and in vitro evaluation of PCL/gelatin hierarchical scaffolds based on melt electrospinning writing and solution electrospinning for bone regeneration Z Wang, H Wang, J Xiong, J Li, X Miao, X Lan, X Liu, W Wang, N Cai, ... Materials Science and Engineering: C 128, 112287, 2021 | 74 | 2021 |
| Absolute optical imaging position encoder H Wang, J Wang, B Chen, P Xiao, X Chen, N Cai, BWK Ling Measurement 67, 42-50, 2015 | 71 | 2015 |
| A new IC solder joint inspection method for an automatic optical inspection system based on an improved visual background extraction algorithm N Cai, J Lin, Q Ye, H Wang, S Weng, BWK Ling IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (1 …, 2015 | 69 | 2015 |
| Melt electrohydrodynamic 3D printed poly (ε-caprolactone)/polyethylene glycol/roxithromycin scaffold as a potential anti-infective implant in bone repair J Bai, H Wang, W Gao, F Liang, Z Wang, Y Zhou, X Lan, X Chen, N Cai, ... International journal of pharmaceutics 576, 118941, 2020 | 66 | 2020 |
| Reversible data hiding based on flexible block-partition and adaptive block-modification strategy S Weng, Y Liu, JS Pan, N Cai Journal of Visual Communication and Image Representation 41, 185-199, 2016 | 52 | 2016 |
| IC solder joint inspection via robust principle component analysis N Cai, Y Zhou, Q Ye, G Liu, H Wang, X Chen IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (2 …, 2017 | 49 | 2017 |
| A novel error compensation method for an absolute optical encoder based on empirical mode decomposition N Cai, W Xie, H Peng, H Wang, Z Yang, X Chen Mechanical Systems and Signal Processing 88, 81-88, 2017 | 45 | 2017 |
| Biodegradable trilayered micro/nano-fibrous membranes with efficient filtration, directional moisture transport and antibacterial properties X Lan, H Wang, Y Liu, X Chen, J Xiong, R Mai, Y Wang, N Cai, X Chen, ... Chemical Engineering Journal 447, 137518, 2022 | 41 | 2022 |
| Infrared object tracking based on particle filters 程建， 周越， 蔡念， 杨杰 Journal of Infrared and Millimeter Waves 25 (2), 113-117, 2006 | 38 | 2006 |
| Survey on fatigue life prediction of BGA solder joints B Qiu, J Xiong, H Wang, S Zhou, X Yang, Z Lin, M Liu, N Cai Electronics 11 (4), 542, 2022 | 36 | 2022 |
| Fabrication of microfluidic channels based on melt-electrospinning direct writing J Zeng, H Wang, Y Lin, J Zhang, F Liang, F Fang, F Yang, P Wang, Z Zhu, ... Microfluidics and Nanofluidics 22, 1-10, 2018 | 32 | 2018 |
| M-Net: a novel U-Net with multi-stream feature fusion and multi-scale dilated convolutions for bile ducts and hepatolith segmentation X Fu, N Cai, K Huang, H Wang, P Wang, C Liu, H Wang IEEE Access 7, 148645-148657, 2019 | 30 | 2019 |
| Difference angle quantization index modulation scheme for image watermarking N Cai, N Zhu, S Weng, BWK Ling Signal Processing: Image Communication 34, 52-60, 2015 | 28 | 2015 |
| IC solder joint inspection based on the Gaussian mixture model N Cai, Q Ye, G Liu, H Wang, Z Yang Soldering & Surface Mount Technology 28 (4), 207-214, 2016 | 26 | 2016 |
| MIMN-DPP: Maximum-information and minimum-noise determinantal point processes for unsupervised hyperspectral band selection W Chen, Z Yang, J Ren, J Cao, N Cai, H Zhao, P Yuen Pattern Recognition 102, 107213, 2020 | 25 | 2020 |
