Frank Niklaus

Citada per

	Totes	Des de 2020
Citacions	9641	4466
Índex h	47	32
Índex i10	129	75

1200

600

300

900

2003200420052006200720082009201020112012201320142015201620172018201920202021202220232024202570 71 90 134 144 185 158 214 310 333 406 372 455 490 479 601 599 645 811 870 874 1125 134

Accés públic

Mostra-ho tot

91 articles

16 articles

disponibles

no disponibles

Es basa en els requisits de les agències que proporcionen el finançament

Coautors

Göran StemmeProfessor, Micro and Nanosystems, KTH Royal Institute of Technology, SwedenCorreu electrònic verificat a ee.kth.se
Andreas C FischerPh.D. from KTH Royal Institute of Technology in Stockholm, SwedenCorreu electrònic verificat a ee.kth.se
Kristinn B. GylfasonProfessor, Micro and Nanosystems, KTH Royal Institute of TechnologyCorreu electrònic verificat a kth.se
Niclas RoxhedAssistant Professor, KTH Royal Institute of TechnologyCorreu electrònic verificat a ee.kth.se
Fredrik ForsbergKTH Royal Institute of TechnologyCorreu electrònic verificat a ee.kth.se
Max C. LemmeProfessor, RWTH Aachen University, Germany, Director, AMO GmbHCorreu electrònic verificat a eld.rwth-aachen.de
Simon J. BleikerPhD Student in Micro and Nanosystmes, KTH Royal Institute of TechnologyCorreu electrònic verificat a kth.se
Stephan SchröderSenseairCorreu electrònic verificat a senseair.com
Anderson David SmithAssociate Professor, Chalmers University of TechnologyCorreu electrònic verificat a kth.se
Mikael ÖstlingKTH Royal Institute of TechnologyCorreu electrònic verificat a kth.se
Pierre EdingerPostdoctoral researcher, KTH Royal Institute of TechnologyCorreu electrònic verificat a kth.se
Xuge FanKTH Royal Institute of TechnologyCorreu electrònic verificat a kth.se
Wim BogaertsGhent UniversityCorreu electrònic verificat a ugent.be
Peter VerheyenCorreu electrònic verificat a imec.be
Niels QuackThe University of SydneyCorreu electrònic verificat a sydney.edu.au
Alain Yuji TakabayashiEnlightraCorreu electrònic verificat a enlightra.com
Carlos Errando-HerranzTU DelftCorreu electrònic verificat a tudelft.nl
Georg S. DuesbergChair of Sensortechnology , Universität der Bundeswehr, MunichCorreu electrònic verificat a unibw.de
tommy haraldssonCTO Mercene LabsCorreu electrònic verificat a kth.se
Anna DelinProfessor of Computational Nanomagnetism, KTH, StockholmCorreu electrònic verificat a kth.se

Segueix

Frank Niklaus

Professor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, Sweden

Correu electrònic verificat a kth.se - Pàgina d'inici

MEMS NEMS Wafer Bonding Wafer-Level Packaging Micro 3D Printing


Títol Ordena per cites Ordena per any Ordena per títol	Citada per Citada per	Any
Handbook of Silicon Based MEMS Materials and Technologies M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Kröckel, ... Handbook of Silicon Based MEMS Materials and Technologies (Second Edition …, 2015	759*	2015
Adhesive wafer bonding F Niklaus, G Stemme, JQ Lu, RJ Gutmann Journal of applied physics 99 (3), 2006	700	2006
MEMS-based uncooled infrared bolometer arrays: a review F Niklaus, C Vieider, H Jakobsen MEMS/MOEMS technologies and applications III 6836, 125-139, 2008	468*	2008
Electromechanical piezoresistive sensing in suspended graphene membranes AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ... Nano letters 13 (7), 3237-3242, 2013	449	2013
Resistive graphene humidity sensors with rapid and direct electrical readout AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ... Nanoscale 7 (45), 19099-19109, 2015	360	2015
Integrating MEMS and ICs AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, Stemme, Göran, N Roxhed, ... Microsystems & Nanoengineering 1 (1), 15005, 2015	354	2015
Low-temperature full wafer adhesive bonding F Niklaus, P Enoksson, E Kälvesten, G Stemme Journal of Micromechanics and Microengineering 11 (2), 100, 2001	326	2001
Method of joining components E Kälvesten, G Stemme, F Niklaus US Patent 7,067,345, 2006	265	2006
Sealing of adhesive bonded devices on wafer level J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 110 (1-3), 407-412, 2004	200	2004
Handbook of wafer bonding P Ramm, JJQ Lu, MMV Taklo John Wiley & Sons, 2012	181	2012
Wearable all-solid-state potentiometric microneedle patch for intradermal potassium detection M Parrilla, M Cuartero, S Padrell Sánchez, M Rajabi, N Roxhed, F Niklaus, ... Analytical chemistry 91 (2), 1578-1586, 2018	180	2018
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding A Quellmalz, X Wang, S Sawallich, B Uzlu, M Otto, S Wagner, Z Wang, ... Nature communications 12 (1), 917, 2021	169	2021
Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS M Lapisa, G Stemme, F Niklaus IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 629-644, 2011	166	2011
Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels H Andersson, W van der Wijngaart, P Griss, F Niklaus, G Stemme Sensors and Actuators B: Chemical 75 (1-2), 136-141, 2001	166	2001
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ... ACS nano 10 (11), 9879-9886, 2016	154	2016
Nanoelectromechanical sensors based on suspended 2D materials MC Lemme, S Wagner, K Lee, X Fan, GJ Verbiest, S Wittmann, S Lukas, ... Research, 2020	152	2020
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 105 (3), 297-304, 2003	143	2003
Low temperature full wafer adhesive bonding of structured wafers F Niklaus, H Andersson, P Enoksson, G Stemme Sensors and Actuators A: Physical 92 (1-3), 235-241, 2001	140	2001
Encyclopedia of sensors CA Grimes, EC Dickey, MV Pishko, RA Marcus (No Title), 2006	133	2006
Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure F Niklaus, A Decharat, C Jansson, G Stemme Infrared Physics & Technology 51 (3), 168-177, 2008	117	2008

En aquests moments el sistema no pot dur a terme l'operació. Torneu-ho a provar més tard.

Articles 1–20

Cites per any

Cites duplicades

Cites combinades

Addició de coautorsCoautors

Segueix

Citada per

Coautors