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Shiyuan Liu (刘世元)Huazhong University of Science and TechnologyCorreu electrònic verificat a hust.edu.cn- Xiuguo Chen (陈修国)Huazhong University of Science and TechnologyCorreu electrònic verificat a hust.edu.cn
- Hao JiangHuazhong University of Science and TechnologyCorreu electrònic verificat a hust.edu.cn
- Renjie ZhouThe Chinese University of Hong KongCorreu electrònic verificat a cuhk.edu.hk
- Paul V. BraunProfessor of Materials Science and Engineering, University of Illinois at Urbana-ChampaignCorreu electrònic verificat a illinois.edu
- Corey A. RichardsUniversity of Illinois Urbana-ChampaignCorreu electrònic verificat a illinois.edu
- Christian OcierPhD, University of Illinois at Urbana-ChampaignCorreu electrònic verificat a illinois.edu
- Lenan ZhangAssistant Professor, Cornell University; Ph.D., MITCorreu electrònic verificat a cornell.edu
- Evelyn N WangMechanical Engineering, MITCorreu electrònic verificat a mit.edu
- Kyle WilkeMIT Mechanical EngineeringCorreu electrònic verificat a mit.edu
- Mark BrongersmaStanford UniversityCorreu electrònic verificat a stanford.edu
- Jung-Hwan SongNational University of Singapore, Assistant professorCorreu electrònic verificat a nus.edu.sg
- Jian-Ming JinProfessor of Electrical and Computer Engineering, University of Illinois at Urbana-ChampaignCorreu electrònic verificat a illinois.edu
- Lin ZhaoMassachusetts Institute of TechnologyCorreu electrònic verificat a alum.mit.edu
- Zhengmao LuAssistant Professor, EPFLCorreu electrònic verificat a epfl.ch
- Zhenyuan XuShanghai Jiao Tong UniversityCorreu electrònic verificat a sjtu.edu.cn
- xin yu 于欣MNTL at UIUCCorreu electrònic verificat a illinois.edu
- Shuai Gong （龚帅）Shanghai Jiao Tong University; Massachusetts Institute of Technology (MIT)Correu electrònic verificat a sjtu.edu.cn
- Baoliang GeMassachusetts Institute of TechnologyCorreu electrònic verificat a mit.edu
- Kedi ZhangPhD of Electrical and Computer Engineering, University of Illinois at Urbana-ChampaignCorreu electrònic verificat a illinois.edu
