| Comprehensive study on 2.5 D package design for board-level reliability in thermal cycling and power cycling S Shao, Y Niu, J Wang, R Liu, S Park, H Lee, G Refai-Ahmed, L Yip 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1668-1675, 2018 | 48 | 2018 |
| Design guideline of 2.5 D package with emphasis on warpage control and thermal management J Hong, K Choi, D Oh, SB Park, S Shao, H Wang, Y Niu 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 682-692, 2018 | 42 | 2018 |
| Modeling and design of 2.5 D package with mitigated warpage and enhanced thermo-mechanical reliability J Wang, Y Niu, S Park, A Yatskov 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2477-2483, 2018 | 32 | 2018 |
| A Novel Speckle-Free Digital Image Correlation Method for In Situ Warpage Characterization Y Niu, S Shao, S Park, CL Kao IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (2 …, 2017 | 32 | 2017 |
| A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method Y Niu, J Wang, S Shao, H Wang, H Lee, SB Park Microelectronics reliability 87, 81-88, 2018 | 30 | 2018 |
| A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow J Wang, Y Niu, S Shao, H Wang, J Xu, V Pham, S Park Microelectronics Reliability 112, 113791, 2020 | 24 | 2020 |
| In-Situ Warpage Characterization of BGA Packages with Solder Balls Attached During Reflow with 3D Digital Image Correlation (DIC) Y Niu, H Wang, S Shao, S Park Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, 782-788, 2016 | 24 | 2016 |
| The expermental and numerical study of electromigration in 2.5 D packaging J Xu, Y Niu, SR Cain, S McCann, HH Lee, G Refai-Ahmed, SB Park 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 483-489, 2018 | 23 | 2018 |
| A general strategy of in-situ warpage characterization for solder attached packages with digital image correlation method Y Niu, H Wang, S Park Optics and Lasers in Engineering 93, 9-18, 2017 | 22 | 2017 |
| A new in-situ warpage measurement of a wafer with speckle-free digital image correlation (DIC) method Y Niu, H Lee, S Park 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 425-431, 2015 | 21 | 2015 |
| Design guideline on board-level thermomechanical reliability of 2.5 D package S Shao, Y Niu, J Wang, R Liu, S Park, H Lee, L Yip, G Refai-Ahmed Microelectronics Reliability 111, 113701, 2020 | 17 | 2020 |
| An investigation of moisture-induced interfacial delamination in plastic IC package during solder reflow J Wang, Y Niu, S Park International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 14 | 2017 |
| An accurate experimental determination of effective strain for heterogeneous electronic packages with digital image correlation method Y Niu, VL Pham, J Wang, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (4 …, 2018 | 13 | 2018 |
| The complete packaging reliability studies through one digital image correlation system Y Niu, J Wang, SB Park 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1916-1921, 2017 | 13 | 2017 |
| Die stress in stealth dicing for MEMS S Shao, D Liu, Y Niu, S Park 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 13 | 2016 |
| Experimentally minimizing the gap distance between extra tall packages and PCB using the digital image correlation (DIC) method VL Pham, Y Niu, J Wang, H Wang, C Singh, S Park, C Zhong, SW Koh, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1593-1599, 2018 | 12 | 2018 |
| A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications S Shao, D Liu, Y Niu, K O’Donnell, D Sengupta, S Park Sensors 17 (2), 322, 2017 | 12 | 2017 |
| Warpage Variation Analysis and Model Prediction for Molded Packages Y Niu, W Wang, Z Wang, K Dhandapani, M Schwarz, A Syed 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 819-824, 2019 | 6 | 2019 |
| Mechanical strength characterization of direct bond interfaces for 3D-IC and MEMS applications B Lee, R Katkar, G Gao, G Fountain, S Lee, L Wang, C Mandalapu, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 954-961, 2018 | 6 | 2018 |
| An Experimental and Numerical Study of the dynamic fracture of Glass L Xue, Y Niu, H Lee, D Yu, S Chaparala, S Park International Electronic Packaging Technical Conference and Exhibition 55751 …, 2013 | 5 | 2013 |
Seungbae ParkProfessor of Mechanical Engineering, Binghamton UniversityCorreu electrònic verificat a binghamton.edu