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Mark HersamNorthwestern UniversityCorreu electrònic verificat a northwestern.edu
Joshua D. WoodPrincipal Solutions Engineer, DynatraceCorreu electrònic verificat a dynatrace.com
Vinod K. SangwanNorthwestern University; University of Maryland College Park; Indian Institute of Technology BombayCorreu electrònic verificat a northwestern.edu
Deep JariwalaUniversity of Pennsylvania, Caltech, Northwestern University, Rice UniversityCorreu electrònic verificat a seas.upenn.edu
Kan-Sheng ChenNorthwestern UniversityCorreu electrònic verificat a northwestern.edu
Christopher R RyderBooz Allen HamiltonCorreu electrònic verificat a u.northwestern.edu
Lincoln J LauhonNorthwestern UniversityCorreu electrònic verificat a northwestern.edu
Joohoon KangSungkyunkwan University (SKKU)Correu electrònic verificat a skku.edu
Jae-Hyeok LeeDepartment of Materials Science & Engineering, Northwestern UniversityCorreu electrònic verificat a northwestern.edu
Jian ZhuProfessor, Nankai UniversityCorreu electrònic verificat a nankai.edu.cn
Yang YangNorthwestern UniversityCorreu electrònic verificat a northwestern.edu
Shumao Cui (崔树茂)University of Wisconsin MilwaukeeCorreu electrònic verificat a uwm.edu
Lintao PengArgonne, Nanoscience and Technology, Ph.D Northwestern UniversityCorreu electrònic verificat a u.northwestern.edu
Junmo KangPostdoctoral fellow, Northwestern UniversityCorreu electrònic verificat a northwestern.edu
Yongsuk ChoiAndrew and Peggy Cherng Department of Medical Engineering, California Institute of TechnologyCorreu electrònic verificat a caltech.edu
Jeong Ho ChoYonsei UniversityCorreu electrònic verificat a yonsei.ac.kr
Jeffrey R. GuestExperimental Physicist, Argonne National Laboratory, University of MichiganCorreu electrònic verificat a anl.gov
Itamar BallaIntel Corp.Correu electrònic verificat a u.northwestern.edu
Hyun-Joong ChungProfessor of Chemical & Materials Engineering, University of AlbertaCorreu electrònic verificat a ualberta.ca