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Seungbae Park
Seungbae Park
Professor of Mechanical Engineering, Binghamton University
Correu electrònic verificat a binghamton.edu - Pàgina d'inici
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Fracture criteria for piezoelectric ceramics
S Park, CT Sun
Journal of the american ceramic society 78 (6), 1475-1480, 1995
7471995
Effect of electric field on fracture of piezoelectric ceramics
SB Park, CT Sun
International Journal of Fracture 70, 203-216, 1993
4721993
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading
D Yu, A Al-Yafawi, TT Nguyen, S Park, S Chung
Microelectronics Reliability 51 (3), 649-656, 2011
1892011
Design, fabrication, and experimental characterization of a flap valve IPMC micropump with a flexibly supported diaphragm
TT Nguyen, NS Goo, VK Nguyen, Y Yoo, S Park
Sensors and Actuators A: Physical 141 (2), 640-648, 2008
1422008
Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading
S Park, R Dhakal, L Lehman, E Cotts
Acta materialia 55 (9), 3253-3260, 2007
1372007
Accurate assessment of packaging stress effects on MEMS sensors by measurement and sensor–package interaction simulations
X Zhang, S Park, MW Judy
Journal of microelectromechanical systems 16 (3), 639-649, 2007
1042007
Transient dynamic simulation and full-field test validation for a slim-PCB of mobile phone under drop/impact
S Park, C Shah, J Kwak, C Jang, J Pitarresi, T Park, S Jang
2007 Proceedings 57th Electronic Components and Technology Conference, 914-923, 2007
1042007
Effects of temperature on mechanical properties of SU-8 photoresist material
S Chung, S Park
Journal of Mechanical Science and Technology 27, 2701-2707, 2013
952013
Three-dimensional shape measurement with a fast and accurate approach
Z Wang, H Du, S Park, H Xie
Applied optics 48 (6), 1052-1061, 2009
942009
Characterizing the mechanical properties of actual SAC105, SAC305, and SAC405 solder joints by digital image correlation
TT Nguyen, D Yu, SB Park
Journal of Electronic Materials 40, 1409-1415, 2011
832011
Advanced thermal-moisture analogy scheme for anisothermal moisture diffusion problem
C Jang, S Park, B Han, S Yoon
792008
Three-dimensional and 2.5 dimensional interconnection technology: State of the art
D Liu, S Park
Journal of Electronic Packaging 136 (1), 014001, 2014
742014
A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs
C Cai, J Xu, H Wang, SB Park
Microelectronics Reliability 119, 114065, 2021
722021
Dynamic responses of PCB under product-level free drop impact
D Yu, JB Kwak, S Park, J Lee
Microelectronics Reliability 50 (7), 1028-1038, 2010
712010
Predictive model for optimized design parameters in flip-chip packages and assemblies
S Park, HC Lee, B Sammakia, K Raghunathan
IEEE Transactions on Components and Packaging Technologies 30 (2), 294-301, 2007
702007
Warpage compensating heat spreader
EA Johnson, S Park
US Patent 6,288,900, 2001
582001
Effect of oxidation on indium solderability
J Kim, H Schoeller, J Cho, S Park
Journal of electronic materials 37, 483-489, 2008
552008
Effect of glue on reliability of flip chip BGA packages under thermal cycling
TT Nguyen, D Lee, JB Kwak, S Park
Microelectronics Reliability 50 (7), 1000-1006, 2010
532010
Moisture diffusion modeling–A critical review
EH Wong, SB Park
Microelectronics Reliability 65, 318-326, 2016
502016
Comprehensive study on 2.5 D package design for board-level reliability in thermal cycling and power cycling
S Shao, Y Niu, J Wang, R Liu, S Park, H Lee, G Refai-Ahmed, L Yip
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1668-1675, 2018
482018
En aquests moments el sistema no pot dur a terme l'operació. Torneu-ho a provar més tard.
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