| Carbon nanotube based VLSI interconnects: Analysis and design BK Kaushik, MK Majumder Springer India, 2015 | 128 | 2015 |
| Carbon nanotube: Properties and applications BK Kaushik, MK Majumder, BK Kaushik, MK Majumder Carbon Nanotube Based VLSI Interconnects: Analysis and Design, 17-37, 2015 | 114 | 2015 |
| Analysis of delay and dynamic crosstalk in bundled carbon nanotube interconnects MK Majumder, BK Kaushik, SK Manhas IEEE transactions on electromagnetic compatibility 56 (6), 1666-1673, 2014 | 106 | 2014 |
| Time and frequency domain analysis of MLGNR interconnects VR Kumar, MK Majumder, NR Kukkam, BK Kaushik IEEE Transactions on Nanotechnology 14 (3), 484-492, 2015 | 84 | 2015 |
| Analysis of MWCNT and bundled SWCNT interconnects: Impact on crosstalk and area MK Majumder, ND Pandya, BK Kaushik, SK Manhas IEEE Electron Device Letters 33 (8), 1180-1182, 2012 | 74 | 2012 |
| Stability and delay analysis of multi-layered GNR and multi-walled CNT interconnects VR Kumar, MK Majumder, A Alam, NR Kukkam, BK Kaushik Journal of Computational Electronics 14, 611-618, 2015 | 60 | 2015 |
| Frequency response and bandwidth analysis of multi‐layer graphene nanoribbon and multi‐walled carbon nanotube interconnects MK Majumder, NR Kukkam, BK Kaushik Micro & Nano Letters 9 (9), 557-560, 2014 | 56 | 2014 |
| Delay and crosstalk reliability issues in mixed MWCNT bundle interconnects MK Majumder, PK Das, BK Kaushik Microelectronics Reliability 54 (11), 2570-2577, 2014 | 54 | 2014 |
| Graphene based on-chip interconnects and TSVs: Prospects and challenges VR Kumar, BK Kaushik, MK Majumder IEEE Nanotechnology magazine 8 (4), 14-20, 2014 | 52 | 2014 |
| Carbon nanotube based 3-D interconnects-a reality or a distant dream BK Kaushik, MK Majumder, VR Kumar IEEE Circuits and Systems Magazine 14 (4), 16-35, 2014 | 50 | 2014 |
| Dynamic crosstalk effect in mixed CNT bundle interconnects MK Majumder, ND Pandya, BK Kaushik, SK Manhas Electronics letters 48 (7), 384-385, 2012 | 50 | 2012 |
| Analytical study of bundled MWCNT and edged MLGNR interconnects: impact on propagation delay and area VR Kumbhare, PP Paltani, C Venkataiah, MK Majumder IEEE Transactions on Nanotechnology 18, 606-610, 2019 | 38 | 2019 |
| Through silicon vias: materials, models, design, and performance BK Kaushik, VR Kumar, MK Majumder, A Alam Crc Press, 2016 | 36 | 2016 |
| Process-induced delay variation in SWCNT, MWCNT, and mixed CNT interconnects MK Majumder, J Kumar, BK Kaushik IETE Journal of research 61 (5), 533-540, 2015 | 28 | 2015 |
| Delay uncertainty in MLGNR interconnects under process induced variations of width, doping, dielectric thickness and mean free path KN Reddy, MK Majumder, BK Kaushik Journal of Computational Electronics 13 (3), 639-646, 2014 | 28 | 2014 |
| Hardware security exploiting post-CMOS devices: Fundamental device characteristics, state-of-the-art countermeasures, challenges and roadmap A Japa, MK Majumder, SK Sahoo, R Vaddi, BK Kaushik IEEE Circuits and Systems Magazine 21 (3), 4-30, 2021 | 26 | 2021 |
| Crosstalk induced delay analysis of randomly distributed mixed CNT bundle interconnect MK Majumder, PK Das, VR Kumar, BK Kaushik Journal of Circuits, Systems and Computers 24 (10), 1550145, 2015 | 26 | 2015 |
| Performance analysis of single-and multi-walled carbon nanotube based through silicon vias A Alam, MK Majumder, A Kumari, VR Kumar, BK Kaushik 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1834-1839, 2015 | 21 | 2015 |
| High-speed interconnects: history, evolution, and the road ahead VR Kumbhare, R Kumar, MK Majumder, S Kumar, PP Paltani, BK Kaushik, ... IEEE Microwave Magazine 23 (8), 66-82, 2022 | 20 | 2022 |
| Role of through silicon via in 3D integration: Impact on delay and power S Chandrakar, D Gupta, MK Majumder Journal of Circuits, Systems and Computers 30 (03), 2150051, 2021 | 20 | 2021 |
