Sledovat
Kim S Siow
Kim S Siow
Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (National
E-mailová adresa ověřena na: ukm.edu.my
Název
Citace
Citace
Rok
Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization‐a review
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma processes and polymers 3 (6‐7), 392-418, 2006
11932006
Mechanical properties of nano-silver joints as die attach materials
KS Siow
Journal of Alloys and Compounds 514, 6-19, 2012
4532012
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
KS Siow
Journal of Electronic Materials 43 (4), 947-961, 2014
3662014
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300° C
ST Chua, KS Siow
Journal of Alloys and Compounds 687, 486-498, 2016
1932016
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
TF Chen, KS Siow
Journal of Alloys and Compounds 866, 158783, 2021
1792021
Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study
KS Siow, YT Lin
Journal of Electronic Packaging 138 (2), 020804, 2016
1792016
XPS Study of Sulfur and Phosphorus Compounds with Different Oxidation States
K SIOW, L Britcher, S Kumar, H JGriesser
Sains Malaysiana 47 (8), 1913-1922, 2018
1652018
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
KS Siow
Materials, Process, Equipment, and Reliability, Springer International …, 2019
882019
Mechanical properties of nanocrystalline copper and nickel
KS Siow, AAO Tay, P Oruganti
Materials science and technology 20 (3), 285-294, 2004
862004
Low‐Pressure Plasma Methods for Generating Non‐Reactive Hydrophilic and Hydrogel‐Like Bio‐Interface Coatings–A Review
KS Siow, S Kumar, HJ Griesser
Plasma Processes and Polymers 12 (1), 8-24, 2015
762015
Sulfonated Surfaces by Sulfur Dioxide Plasma Surface Treatment of Plasma Polymer Films
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma Processes and Polymers 6 (9), 583-592, 2009
662009
Plasma polymerized carvone as an antibacterial and biocompatible coating
YW Chan, KS Siow, PY Ng, U Gires, BY Majlis
Materials Science and Engineering: C 68, 861-871, 2016
642016
Deposition and XPS and FTIR Analysis of Plasma Polymer Coatings Containing Phosphorus
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma Processes and Polymers 11 (2), 133-141, 2014
592014
Pitting corrosion of duplex stainless steels
KS Siow, TY Song, JH Qiu
Anti Corrosion Methods and Materials 48 (1), 31-37, 2001
542001
Unveiling the damage evolution of SAC305 during fatigue by entropy generation
X Long, Y Guo, Y Su, KS Siow, C Chen
International Journal of Mechanical Sciences 244, 108087, 2023
512023
QCM-D and XPS study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups
KS Siow, L Britcher, S Kumar, HJ Griesser
Colloids and Surfaces B: Biointerfaces 173, 447-453, 2019
502019
Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging
Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu
Journal of Materials Processing Technology 255, 644-649, 2018
482018
Public benefit and risk perceptions of nanotechnology development: Psychological and sociological aspects
NA Kamarulzaman, KE Lee, KS Siow, M Mokhtar
Technology in Society 62, 101329, 2020
432020
Electrical conductivity of porous silver made from sintered nanoparticles
AS Zuruzi, KS Siow
Electronic Materials Letters 11 (2), 308-314, 2015
392015
Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material
KS Siow, ST Chua
JOM 71 (9), 3066-3075, 2019
332019
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Články 1–20