| A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper TL Brown, C Saldana, TG Murthy, JB Mann, Y Guo, LF Allard, AH King, ... Acta Materialia 57 (18), 5491-5500, 2009 | 182 | 2009 |
| Surface integrity analysis of machined Inconel 718 over multiple length scales R M'Saoubi, T Larsson, J Outeiro, Y Guo, S Suslov, C Saldana, ... CIRP annals 61 (1), 99-102, 2012 | 148 | 2012 |
| Mesoscale folding, instability, and disruption of laminar flow in metal surfaces NK Sundaram, Y Guo, S Chandrasekar Physical review letters 109 (10), 106001, 2012 | 119 | 2012 |
| Controlling deformation and microstructure on machined surfaces Y Guo, C Saldana, WD Compton, S Chandrasekar Acta materialia 59 (11), 4538-4547, 2011 | 118 | 2011 |
| Enhancing material removal processes using modulation-assisted machining JB Mann, Y Guo, C Saldana, WD Compton, S Chandrasekar Tribology International 44 (10), 1225-1235, 2011 | 110 | 2011 |
| In situ analysis of flow dynamics and deformation fields in cutting and sliding of metals Y Guo, WD Compton, S Chandrasekar Proceedings of the Royal Society A: Mathematical, Physical and Engineering …, 2015 | 93 | 2015 |
| Deformation field in large-strain extrusion machining and implications for deformation processing Y Guo, M Efe, W Moscoso, D Sagapuram, KP Trumble, S Chandrasekar Scripta Materialia 66 (5), 235-238, 2012 | 68 | 2012 |
| Microstructure refinement of tungsten by surface deformation for irradiation damage resistance M Efe, O El-Atwani, Y Guo, DR Klenosky Scripta Materialia 70, 31-34, 2014 | 65 | 2014 |
| Surface folding in metals: a mechanism for delamination wear in sliding A Mahato, Y Guo, NK Sundaram, S Chandrasekar Proceedings of the Royal Society A: Mathematical, Physical and Engineering …, 2014 | 55 | 2014 |
| On control of flow instabilities in cutting of metals D Sagapuram, H Yeung, Y Guo, A Mahato, R M'Saoubi, WD Compton, ... CIRP Annals 64 (1), 49-52, 2015 | 48 | 2015 |
| A framework for interactive work design based on motion tracking, simulation, and analysis L Ma, W Zhang, H Fu, Y Guo, D Chablat, F Bennis, A Sawanoi, ... Human Factors and Ergonomics in Manufacturing & Service Industries 20 (4 …, 2010 | 44 | 2010 |
| Control of deformation levels on machined surfaces Y Guo, R M'Saoubi, S Chandrasekar CIRP annals 60 (1), 137-140, 2011 | 43 | 2011 |
| Enhancing tool life in high-speed machining of compacted graphite iron (CGI) using controlled modulation Y Guo, JB Mann, H Yeung, S Chandrasekar Tribology Letters 47, 103-111, 2012 | 42 | 2012 |
| Simulators for driving safety study–a literature review Y Wang, W Zhang, S Wu, Y Guo Virtual Reality: Second International Conference, ICVR 2007, Held as part of …, 2007 | 37 | 2007 |
| Modulation-assisted high speed machining of compacted graphite iron (CGI) Y Guo, T Stalbaum, J Mann, H Yeung, S Chandrasekar Journal of Manufacturing Processes 15 (4), 426-431, 2013 | 32 | 2013 |
| Modulation-assisted machining: a new paradigm in material removal processes JB Mann, Y Guo, C Saldana, H Yeung, WD Compton, S Chandrasekar Advanced Materials Research 223, 514-522, 2011 | 24 | 2011 |
| Folding in metal polycrystals: microstructural origins and mechanics NK Sundaram, A Mahato, Y Guo, K Viswanathan, S Chandrasekar Acta Materialia 140, 67-78, 2017 | 23 | 2017 |
| Effects of controlled modulation on surface textures in deep-hole drilling JB Mann, CJ Saldana, Y Guo, H Yeung, WD Compton, S Chandrasekar SAE International Journal of Materials and Manufacturing 6 (1), 24-32, 2013 | 18 | 2013 |
| In situ analysis of deformation mechanics of constrained cutting toward enhanced material removal Y Guo, J Chen, A Saleh Journal of Manufacturing Science and Engineering 142 (2), 021002, 2020 | 17 | 2020 |
| Sinuous flow and folding in metals: Implications for delamination wear and surface phenomena in sliding and cutting A Mahato, H Yeung, Y Guo, K Viswanathan, NK Sundaram, A Udupa, ... Wear 376, 1534-1541, 2017 | 17 | 2017 |
Srinivasan ChandrasekarCenter for Materials Processing and Tribology, Purdue UniversityE-mailová adresa ověřena na: purdue.edu