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Ryckaert Julien
Ryckaert Julien
E-mailová adresa ověřena na: imec.be
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Citace
Citace
Rok
Ultra-wideband channel model for communication around the human body
A Fort, J Ryckaert, C Desset, P De Doncker, P Wambacq, L Van Biesen
IEEE Journal on Selected Areas in Communications 24 (4), 927-933, 2006
3942006
Channel model for wireless communication around human body
J Ryckaert, P De Doncker, R Meys, A de Le Hoye, S Donnay
Electronics letters 40 (9), 543-544, 2004
3262004
Ultra-wide-band transmitter for low-power wireless body area networks: Design and evaluation
J Ryckaert, C Desset, A Fort, M Badaroglu, V De Heyn, P Wambacq, ...
IEEE transactions on circuits and systems I: Regular papers 52 (12), 2515-2525, 2005
3012005
Human++: autonomous wireless sensors for body area networks
B Gyselinckx, C Van Hoof, J Ryckaert, RF Yazicioglu, P Fiorini, V Leonov
Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005., 13-19, 2005
2392005
The Complementary FET (CFET) for CMOS scaling beyond N3
J Ryckaert, P Schuddinck, P Weckx, G Bouche, B Vincent, J Smith, ...
2018 IEEE Symposium on Vlsi Technology, 141-142, 2018
2092018
Characterization of the ultra wideband body area propagation channel
A Fort, C Desset, J Ryckaert, P De Doncker, L Van Biesen, P Wambacq
2005 IEEE International Conference on Ultra-Wideband, 6 pp., 2005
1732005
A 2-mm0.1–5 GHz Software-Defined Radio Receiver in 45-nm Digital CMOS
V Giannini, P Nuzzo, C Soens, K Vengattaramane, J Ryckaert, M Goffioul, ...
IEEE Journal of Solid-State Circuits 44 (12), 3486-3498, 2009
1612009
Novel forksheet device architecture as ultimate logic scaling device towards 2nm
P Weckx, J Ryckaert, ED Litta, D Yakimets, P Matagne, P Schuddinck, ...
2019 IEEE International Electron Devices Meeting (IEDM), 36.5. 1-36.5. 4, 2019
1322019
A 16mA UWB 3-to-5GHz 20Mpulses/s Quadrature Analog Correlation Receiver in 0.18/spl mu/m CMOS
J Ryckaert, M Badaroglu, V De Heyn, G Van der Plas, P Nuzzo, ...
2006 IEEE International Solid State Circuits Conference-Digest of Technical …, 2006
1262006
Ultra wide-band body area channel model
A Fort, C Desset, J Ryckaert, P De Doncker, L Van Biesen, S Donnay
IEEE International Conference on Communications, 2005. ICC 2005. 2005 4 …, 2005
1242005
Future logic scaling: Towards atomic channels and deconstructed chips
SB Samavedam, J Ryckaert, E Beyne, K Ronse, N Horiguchi, Z Tokei, ...
2020 IEEE International Electron Devices Meeting (IEDM), 1.1. 1-1.1. 10, 2020
1022020
Design technology co-optimization for a robust 10nm Metal1 solution for Logic design and SRAM
B Vandewalle, B Chava, S Sakhare, J Ryckaert, M Dusa
Design-Process-Technology Co-optimization for Manufacturability VIII 9053 …, 2014
972014
Human++: Emerging technology for body area networks
B Gyselinckx, R Borzi, P Mattelaer
Wireless Technologies, 221-240, 2017
962017
A 0.65-to-1.4 nJ/burst 3-to-10 GHz UWB all-digital TX in 90 nm CMOS for IEEE 802.15. 4a
J Ryckaert, G Van der Plas, V De Heyn, C Desset, B Van Poucke, ...
IEEE Journal of Solid-State Circuits 42 (12), 2860-2869, 2007
942007
Nanowire & nanosheet FETs for ultra-scaled, high-density logic and memory applications
A Veloso, T Huynh-Bao, P Matagne, D Jang, G Eneman, N Horiguchi, ...
Solid-State Electronics 168, 107736, 2020
932020
Integrated circuit chip with power delivery network on the backside of the chip
E Beyne, J Ryckaert
US Patent 10,636,739, 2020
912020
A CMOS ultra-wideband receiver for low data-rate communication
J Ryckaert, M Verhelst, M Badaroglu, S D'Amico, V De Heyn, C Desset, ...
IEEE Journal of Solid-State Circuits 42 (11), 2515-2527, 2007
882007
A 2.4 GHz Low-Power Sixth-Order RF Bandpass Converter in CMOS
J Ryckaert, J Borremans, B Verbruggen, L Bos, C Armiento, J Craninckx, ...
IEEE Journal of Solid-State Circuits 44 (11), 2873-2880, 2009
862009
First monolithic integration of 3D complementary FET (CFET) on 300mm wafers
S Subramanian, M Hosseini, T Chiarella, S Sarkar, P Schuddinck, ...
2020 Ieee Symposium on Vlsi Technology, 1-2, 2020
842020
SOP integration and codesign of antennas
S Brebels, J Ryckaert, B Come, S Donnay, W De Raedt, E Beyne, ...
IEEE Transactions on Advanced Packaging 27 (2), 341-351, 2004
842004
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Články 1–20