| Device exploration of nanosheet transistors for sub-7-nm technology node D Jang, D Yakimets, G Eneman, P Schuddinck, MG Bardon, P Raghavan, ... IEEE Transactions on Electron Devices 64 (6), 2707-2713, 2017 | 275 | 2017 |
| Vertical GAAFETs for the ultimate CMOS scaling D Yakimets, G Eneman, P Schuddinck, TH Bao, MG Bardon, P Raghavan, ... IEEE Transactions on Electron Devices 62 (5), 1433-1439, 2015 | 220 | 2015 |
| The Complementary FET (CFET) for CMOS scaling beyond N3 J Ryckaert, P Schuddinck, P Weckx, G Bouche, B Vincent, J Smith, ... 2018 IEEE Symposium on Vlsi Technology, 141-142, 2018 | 209 | 2018 |
| Understanding energy efficiency benefits of carbon nanotube field-effect transistors for digital VLSI G Hills, MG Bardon, G Doornbos, D Yakimets, P Schuddinck, R Baert, ... IEEE Transactions on Nanotechnology 17 (6), 1259-1269, 2018 | 145 | 2018 |
| Novel forksheet device architecture as ultimate logic scaling device towards 2nm P Weckx, J Ryckaert, ED Litta, D Yakimets, P Matagne, P Schuddinck, ... 2019 IEEE International Electron Devices Meeting (IEDM), 36.5. 1-36.5. 4, 2019 | 132 | 2019 |
| Power aware FinFET and lateral nanosheet FET targeting for 3nm CMOS technology D Yakimets, MG Bardon, D Jang, P Schuddinck, Y Sherazi, P Weckx, ... 2017 IEEE International Electron Devices Meeting (IEDM), 20.4. 1-20.4. 4, 2017 | 123 | 2017 |
| First monolithic integration of 3D complementary FET (CFET) on 300mm wafers S Subramanian, M Hosseini, T Chiarella, S Sarkar, P Schuddinck, ... 2020 Ieee Symposium on Vlsi Technology, 1-2, 2020 | 84 | 2020 |
| Enabling sub-5nm CMOS technology scaling thinner and taller! J Ryckaert, MH Na, P Weckx, D Jang, P Schuddinck, B Chehab, S Patli, ... 2019 IEEE International Electron Devices Meeting (IEDM), 29.4. 1-29.4. 4, 2019 | 83 | 2019 |
| Extreme scaling enabled by 5 tracks cells: Holistic design-device co-optimization for FinFETs and lateral nanowires MG Bardon, Y Sherazi, P Schuddinck, D Jang, D Yakimets, P Debacker, ... 2016 IEEE International Electron Devices Meeting (IEDM), 28.2. 1-28.2. 4, 2016 | 82 | 2016 |
| Vertical device architecture for 5nm and beyond: device & circuit implications AVY Thean, D Yakimets, TH Bao, P Schuddinck, S Sakhare, MG Bardon, ... 2015 Symposium on VLSI Technology (VLSI Technology), T26-T27, 2015 | 62 | 2015 |
| Stacked nanosheet fork architecture for SRAM design and device co-optimization toward 3nm P Weckx, J Ryckaert, V Putcha, A De Keersgieter, J Boemmels, ... 2017 IEEE International Electron Devices Meeting (IEDM), 20.5. 1-20.5. 4, 2017 | 59 | 2017 |
| Device-, circuit-& block-level evaluation of CFET in a 4 track library P Schuddinck, O Zografos, P Weckx, P Matagne, S Sarkar, Y Sherazi, ... 2019 Symposium on VLSI Technology, T204-T205, 2019 | 58 | 2019 |
| Power-performance trade-offs for lateral nanosheets on ultra-scaled standard cells MG Bardon, Y Sherazi, D Jang, D Yakimets, P Schuddinck, R Baert, ... 2018 IEEE Symposium on VLSI Technology, 143-144, 2018 | 56 | 2018 |
| Holisitic device exploration for 7nm node P Raghavan, MG Bardon, D Jang, P Schuddinck, D Yakimets, J Ryckaert, ... 2015 IEEE Custom Integrated Circuits Conference (CICC), 1-5, 2015 | 51 | 2015 |
| Introducing 2D-FETs in device scaling roadmap using DTCO Z Ahmed, A Afzalian, T Schram, D Jang, D Verreck, Q Smets, ... 2020 IEEE International Electron Devices Meeting (IEDM), 22.5. 1-22.5. 4, 2020 | 48 | 2020 |
| Dimensioning for power and performance under 10nm: The limits of FinFETs scaling MG Bardon, P Schuddinck, P Raghavan, D Jang, D Yakimets, A Mercha, ... 2015 International Conference on IC Design & Technology (ICICDT), 1-4, 2015 | 48 | 2015 |
| A comprehensive study of nanosheet and forksheet SRAM for beyond N5 node MK Gupta, P Weckx, P Schuddinck, D Jang, B Chehab, S Cosemans, ... IEEE Transactions on Electron Devices 68 (8), 3819-3825, 2021 | 43 | 2021 |
| Layout-induced stress effects in 14nm & 10nm FinFETs and their impact on performance MG Bardon, V Moroz, G Eneman, P Schuddinck, M Dehan, D Yakimets, ... 2013 Symposium on VLSI Technology, T114-T115, 2013 | 43 | 2013 |
| DTCO at N7 and beyond: patterning and electrical compromises and opportunities J Ryckaert, P Raghavan, P Schuddinck, HB Trong, A Mallik, SS Sakhare, ... Design-Process-Technology Co-optimization for Manufacturability IX 9427, 101-108, 2015 | 38 | 2015 |
| Limitations on lateral nanowire scaling beyond 7-nm node UK Das, MG Bardon, D Jang, G Eneman, P Schuddinck, D Yakimets, ... IEEE Electron Device Letters 38 (1), 9-11, 2016 | 37 | 2016 |
