| Automatic in-situ focus monitor using line-shortening effect YC Kim, G Yeo, JH Lee, H Kim, UI Chung Metrology, Inspection, and Process Control for Microlithography XIII 3677 …, 1999 | 29 | 1999 |
| ArF lithography options for 100-nm technologies G Vandenberghe, YC Kim, C Delvaux, KD Lucas, SJ Choi, M Ercken, ... Optical Microlithography XIV 4346, 179-190, 2001 | 22 | 2001 |
| Focus test mask for projection exposure system, focus monitoring system using the same, and focus monitoring method YC Kim US Patent 6,088,113, 2000 | 21 | 2000 |
| Pinusolide and 15‐methoxypinusolidic acid attenuate the neurotoxic effect of staurosporine in primary cultures of rat cortical cells KA Koo, MK Lee, SH Kim, EJ Jeong, SY Kim, TH Oh, YC Kim British journal of pharmacology 150 (1), 65-71, 2007 | 19 | 2007 |
| Evaluation of stray light and quantitative analysis of its impact on lithography YC Kim, P De Bisschop, G Vandenberghe Journal of Micro/Nanolithography, MEMS and MOEMS 4 (4), 043002-043002-16, 2005 | 18 | 2005 |
| Alignment mark of semiconductor wafer for use in aligning the wafer with exposure equipment, alignment system for producing alignment signals from the alignment mark, and … YC Kim, H Ryuk, Y Han US Patent 6,501,189, 2002 | 14 | 2002 |
| Reduction of systematic defects with machine learning from design to fab Y Ma, L Hong, J Word, F Jiang, V Liubich, L Cao, S Jayaram, D Kwak, ... Advanced Etch Technology for Nanopatterning IX 11329, 12-25, 2020 | 13 | 2020 |
| Predictable etch model using machine learning Y Kim, S Jung, DH Kwak, V Liubich, G Fenger Optical Microlithography XXXII 10961, 14-24, 2019 | 13 | 2019 |
| OPC in memory-device patterns using boundary layer model for 3-dimensional mask topographic effect YC Kim, I Kim, JG Park, S Kim, S Suh, Y Cheon, S Lee, J Lee, CJ Kang, ... Optical Microlithography XX 6520, 338-349, 2007 | 13 | 2007 |
| Retarget process modeling method, method of fabricating mask using the retarget process modeling method, computer readable storage medium, and imaging system YM Lee, YC Kim, SS Suh US Patent App. 12/974,681, 2011 | 12 | 2011 |
| Machine learning models for edge placement error based etch bias Y Meng, YC Kim, S Guo, Z Shu, Y Zhang, Q Liu IEEE Transactions on Semiconductor Manufacturing 34 (1), 42-48, 2020 | 10 | 2020 |
| Semiconductor wafer bearing alignment mark for use in aligning the wafer with exposure equipment, alignment system for producing alignment signals from the alignment mark, and … YC Kim, H Ryuk, Y Han US Patent 7,038,777, 2006 | 10 | 2006 |
| Physical simulation for verification and OPC on full chip level S Shim, S Moon, Y Kim, S Choi, Y Kim, B Küchler, U Klostermann, M Do, ... Optical Microlithography XXIV 7973, 847-855, 2011 | 9 | 2011 |
| Characterization of stray light of ArF lithographic tools: modeling of power spectral density of an optical pupil YC Kim, P De Bisschop, G Vandenberghe Microelectronic engineering 83 (4-9), 643-646, 2006 | 9 | 2006 |
| A methodology for the characterization of topography induced immersion bubble defects M Kocsis, P De Bisschop, M Maenhoudt, YC Kim, G Wells, S Light, ... Optical Microlithography XVIII 5754, 154-163, 2005 | 9 | 2005 |
| OPC to account for thick mask effect using simplified boundary layer model S Kim, YC Kim, S Suh, S Lee, S Lee, S Lee, H Cho, J Moon, J Cobb, ... Photomask Technology 2006 6349, 1033-1040, 2006 | 7 | 2006 |
| Challenge for sub-100-nm DRAM gate printing using ArF lithography with combination of moderate OAI and attPSM YC Kim, G Vandenberghe, S Verhaegen, KG Ronse 21st Annual BACUS Symposium on Photomask Technology 4562, 954-967, 2002 | 7 | 2002 |
| Investigation of EUV tapeout flow issues, requirements, and options for volume manufacturing J Cobb, S Jang, J Ser, I Kim, J Yeap, K Lucas, M Do, YC Kim Extreme Ultraviolet (EUV) Lithography II 7969, 250-261, 2011 | 5 | 2011 |
| Stray-Light implementation in optical proximity correction (OPC) YC Kim, D Kim, I Kim, S Kim, S Suh, YJ Chun, S Lee, J Lee, CJ Kang, ... Photomask and Next-Generation Lithography Mask Technology XIV 6607, 487-496, 2007 | 5 | 2007 |
| Three-dimensional mask effect approximate modeling for sub-50-nm node device OPC S Suh, SJ Lee, K Back, S Lee, Y Kim, S Kim, YJ Chun Design for Manufacturability through Design-Process Integration 6521, 35-42, 2007 | 5 | 2007 |
Ser Jung HoonASMLE-mailová adresa ověřena na: asml.com
