| Calcium-modified silk patch as a next-generation ultrasound coupling medium SM Lee, T Lee, H Kim, Y Jo, MG Kim, S Kim, HM Bae, HJ Lee ACS Applied Materials & Interfaces 13 (47), 55827-55839, 2021 | 13 | 2021 |
| FPCB as an acoustic matching layer for 1D linear ultrasound transducer arrays T Lee, J Jung, SM Lee, J Park, JH Park, KW Paik, HJ Lee Sensors 22 (15), 5557, 2022 | 4 | 2022 |
| Fabrication of Capacitive Micromachined Ultrasonic Transducers With High-k Insulation Layer Using Silicon Fusion Bonding S Bang, C Oh, SM Lee, S Kim, T Lee, S Nam, J Jung, HJ Lee Journal of Microelectromechanical Systems, 2024 | | 2024 |
| 정전용량형 미세가공 초음파 트랜스듀서 및 이의 제조 방법 이현주， 방상호， 이태민， 오채린 KR Patent App. 10-2024-0,033,958, 2024 | | 2024 |
| 습도센서 모듈과 이를 구비하는 습도 측정장치 및 이를 이용하는 습도측정 방법 이현주， 이태민， 이상목 KR Patent 10-2,630,328, 2024 | | 2024 |
| Development of Flex-to-Rigid Capacitive Micromachined Ultrasound Transducer (CMUT) with Bending Modulation SM Lee, T Lee, C Oh, HJ Lee 2023 22nd International Conference on Solid-State Sensors, Actuators and …, 2023 | | 2023 |
| CMUT Humidity Sensor with a Calcium-Modified Silk Functionalized Layer T Lee, SM Lee, HJ Lee 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 2023 | | 2023 |
| Calcium-Modified Silk Film as a Patch-Type Ultrasound Coupling Medium S Lee, T Lee, H Kim, Y Jo, S Kim, HJ Lee 2022 MRS Spring Meeting & Exhibit, 2022 | | 2022 |
| Calcium-Modified Silk Adhesive as Coupling Medium for Next-Generation Ultrasound Patch Applications T Lee, H Kim, MG Kim, HM Bae, HJ Lee 42nd Annual International Conferences of the IEEE Engineering in Medicine …, 2020 | | 2020 |