| 2D and 3D numerical models of metal cutting with damage effects O Pantalé, JL Bacaria, O Dalverny, R Rakotomalala, S Caperaa Computer methods in applied mechanics and engineering 193 (39-41), 4383-4399, 2004 | 302 | 2004 |
| Study of image characteristics on digital image correlation error assessment M Fazzini, S Mistou, O Dalverny, L Robert Optics and Lasers in Engineering 48 (3), 335-339, 2010 | 98 | 2010 |
| Global methodology for damage detection and localization in civil engineering structures F Frigui, JP Faye, C Martin, O Dalverny, F Pérès, S Judenherc Engineering structures 171, 686-695, 2018 | 71 | 2018 |
| Intra-ply yarn sliding defect in hemisphere preforming of a woven preform AR Labanieh, C Garnier, P Ouagne, O Dalverny, D Soulat Composites Part A: Applied Science and Manufacturing 107, 432-446, 2018 | 59 | 2018 |
| Microstructural evolutions of Sn-3.0 Ag-0.5 Cu solder joints during thermal cycling JB Libot, J Alexis, O Dalverny, L Arnaud, P Milesi, F Dulondel Microelectronics Reliability 83, 64-76, 2018 | 54 | 2018 |
| Reliability of lead-free solder in power module with stochastic uncertainty A Micol, C Martin, O Dalverny, M Mermet-Guyennet, M Karama Microelectronics Reliability 49 (6), 631-641, 2009 | 30 | 2009 |
| Thermomechanical modelling and reliability study of an IGBT module for an aeronautical application A Zeanh, O Dalverny, M Karama, E Woirgard, S Azzopardi, A Bouzourene, ... EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008 | 29 | 2008 |
| Non destructive investigation of defects in composite structures by three infrared thermographic techniques E Péronnet, ML Pastor, R Huillery, O Dalverny, S Mistou, H Welemane International conference on experimental mechanics ICEM 15, 0, 2012 | 23 | 2012 |
| Hybrid approach for woven fabric modelling based on discrete hypoelastic behaviour and experimental validation M Nasri, C Garnier, F Abbassi, AR Labanieh, O Dalverny, A Zghal Composite Structures 209, 992-1004, 2019 | 22 | 2019 |
| Lifetime and reliability assessment of AlN substrates used in harsh aeronautic environments power switch modules A Zéanh, O Dalverny, M Karama, A Bouzourene Advanced Materials Research 112, 113-127, 2010 | 21 | 2010 |
| Verification of a spherical plain bearing finite-element model using scattered light photoelasticity tests A Germaneau, F Peyruseigt, S Mistou, O Dalverny, P Doumalin, JC Dupré Proceedings of the Institution of Mechanical Engineers, Part J: Journal of …, 2008 | 19 | 2008 |
| Experimental and numerical simulation of super-pressure balloon apex section: Mechanical behavior in realistic flight conditions P Vialettes, JM Siguier, P Guigue, M Karama, S Mistou, O Dalverny, ... Advances in Space Research 37 (11), 2082-2086, 2006 | 18 | 2006 |
| Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations JB Libot, L Arnaud, O Dalverny, J Alexis, P Milesi, F Dulondel 2016 International Conference on Electronics Packaging (ICEP), 231-236, 2016 | 17 | 2016 |
| Mechanical characterization of an Au-Ge solder alloy for high temperature electronic devices S Msolli, O Dalverny, J Alexis, M Karama 2010 6th International Conference on Integrated Power Electronics Systems, 1-5, 2010 | 17 | 2010 |
| An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications A Micol, A Zeanh, T Lhommeau, S Azzopardi, E Woirgard, O Dalverny, ... Microelectronics Reliability 49 (9-11), 1370-1374, 2009 | 17 | 2009 |
| Effect of silver and strontium incorporation route on hydroxyapatite coatings elaborated by rf-SPS M Chambard, D Remache, Y Balcaen, O Dalverny, J Alexis, R Siadous, ... Materialia 12, 100809, 2020 | 15 | 2020 |
| Electrical and mechanical characterisation of Si/Al ohmic contacts on diamond G Civrac, S Msolli, J Alexis, O Dalverny, H Schneider Electronics letters 46 (11), 791-793, 2010 | 14 | 2010 |
| A three-dimensional transient numerical model of milling JL Bacaria, O Dalverny, S Caperaa Proceedings of the Institution of Mechanical Engineers, Part B: Journal of …, 2001 | 14 | 2001 |
| Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurements JB Libot, F Dulondel, P Milesi, J Alexis, L Arnaud, O Dalverny 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 748-755, 2018 | 13 | 2018 |
| Mesure 3D sans contact des déplacements et déformations sur des films plastiques transparents par stéréo-corrélation S Mistou, M Karama, O Dalverny, JM Siguier, P Guigue-Joguet Mécanique & industries 4 (6), 637-643, 2003 | 12 | 2003 |
Joel AlexisProfessor, Université de Toulouse, INP/ENITVerificeret mail på enit.fr