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Samuel Graham
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A universal method to produce low–work function electrodes for organic electronics
Y Zhou, C Fuentes-Hernandez, J Shim, J Meyer, AJ Giordano, H Li, ...
Science 336 (6079), 327-332, 2012
23102012
Ultrawide‐bandgap semiconductors: research opportunities and challenges
JY Tsao, S Chowdhury, MA Hollis, D Jena, NM Johnson, KA Jones, ...
Advanced Electronic Materials 4 (1), 1600501, 2018
14282018
Thermal effects in packaging high power light emitting diode arrays
A Christensen, S Graham
Applied thermal engineering 29 (2-3), 364-371, 2009
4052009
β-Gallium oxide power electronics
AJ Green, J Speck, G Xing, P Moens, F Allerstam, K Gumaelius, T Neyer, ...
Apl Materials 10 (2), 2022
3592022
Electrical, thermal, and mechanical characterization of silicon microcantilever heaters
J Lee, T Beechem, TL Wright, BA Nelson, S Graham, WP King
Journal of Microelectromechanical Systems 15 (6), 1644-1655, 2006
2802006
Highly tunable molecular sieving and adsorption properties of mixed-linker zeolitic imidazolate frameworks
K Eum, KC Jayachandrababu, F Rashidi, K Zhang, J Leisen, S Graham, ...
Journal of the American Chemical Society 137 (12), 4191-4197, 2015
2392015
Controlled doping of large-area trilayer MoS2 with molecular reductants and oxidants.
A Tarasov, S Zhang, MY Tsai, PM Campbell, S Graham, S Barlow, ...
Advanced Materials (Deerfield Beach, Fla.) 27 (7), 1175-1181, 2015
2352015
Stability of doped transparent carbon nanotube electrodes
R Jackson, B Domercq, R Jain, B Kippelen, S Graham
Advanced Functional Materials 18 (17), 2548-2554, 2008
2262008
Invited Article: Simultaneous mapping of temperature and stress in microdevices using micro-Raman spectroscopy
T Beechem, S Graham, SP Kearney, LM Phinney, JR Serrano
Review of Scientific Instruments 78 (6), 2007
2082007
Interfacial thermal conductance across room-temperature-bonded GaN/diamond interfaces for GaN-on-diamond devices
Z Cheng, F Mu, L Yates, T Suga, S Graham
ACS applied materials & interfaces 12 (7), 8376-8384, 2020
1802020
Development of a thermal resistance model for chip-on-board packaging of high power LED arrays
M Ha, S Graham
Microelectronics Reliability 52 (5), 836-844, 2012
1792012
Void growth in 6061-aluminum alloy under triaxial stress state
H Agarwal, AM Gokhale, S Graham, MF Horstemeyer
Materials Science and Engineering: A 341 (1-2), 35-42, 2003
1662003
Elastomer–polymer semiconductor blends for high-performance stretchable charge transport networks
D Choi, H Kim, N Persson, PH Chu, M Chang, JH Kang, S Graham, ...
Chemistry of Materials 28 (4), 1196-1204, 2016
1572016
Influence of interfacial mixing on thermal boundary conductance across a chromium/silicon interface
PE Hopkins, PM Norris, RJ Stevens, TE Beechem, S Graham
1562008
Review of stability and thermal conductivity enhancements for salt hydrates
N Kumar, J Hirschey, TJ LaClair, KR Gluesenkamp, S Graham
Journal of Energy Storage 24, 100794, 2019
1522019
Solution-based electrical doping of semiconducting polymer films over a limited depth
VA Kolesov, C Fuentes-Hernandez, WF Chou, N Aizawa, FA Larrain, ...
Nature Materials 16 (4), 474-480, 2017
1522017
Experimental observation of high intrinsic thermal conductivity of AlN
Z Cheng, YR Koh, A Mamun, J Shi, T Bai, K Huynh, L Yates, Z Liu, R Li, ...
Physical Review Materials 4 (4), 044602, 2020
1512020
Thermal analysis of near-isothermal compressed gas energy storage system
A Odukomaiya, A Abu-Heiba, KR Gluesenkamp, O Abdelaziz, ...
Applied energy 179, 948-960, 2016
1512016
A practical extension of the 3ω method to multilayer structures
BW Olson, S Graham, K Chen
Review of Scientific Instruments 76 (5), 2005
1492005
Low thermal boundary resistance interfaces for GaN-on-diamond devices
L Yates, J Anderson, X Gu, C Lee, T Bai, M Mecklenburg, T Aoki, ...
ACS applied materials & interfaces 10 (28), 24302-24309, 2018
1412018
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