Folgen
Matiar Howlader
Matiar Howlader
Professor of Electrical and Computer Engineering, McMaster University
Bestätigte E-Mail-Adresse bei mcmaster.ca - Startseite
Titel
Zitiert von
Zitiert von
Jahr
Room temperature Cu–Cu direct bonding using surface activated bonding method
TH Kim, MMR Howlader, T Itoh, T Suga
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 21 (2 …, 2003
3622003
Microfabricated electrochemical pH and free chlorine sensors for water quality monitoring: Recent advances and research challenges
Y Qin, HJ Kwon, MMR Howlader, MJ Deen
RSC Advances 5 (85), 69086-69109, 2015
2002015
Electrochemical sensing of acetaminophen using multi-walled carbon nanotube and β-cyclodextrin
AU Alam, Y Qin, MMR Howlader, NX Hu, MJ Deen
Sensors and Actuators B: Chemical, 2017
1852017
Polymer integration for packaging of implantable sensors
Y Qin, MMR Howlader, MJ Deen, YM Haddara, PR Selvaganapathy
Sensors and Actuators B: Chemical 202, 758-778, 2014
1762014
Polymers and organic materials-based pH sensors for healthcare applications
AU Alam, Y Qin, S Nambiar, JTW Yeow, MMR Howlader, NX Hu, MJ Deen
Progress in Materials Science 96, 174-216, 2018
1602018
The effects of oxygen plasma and humidity on surface roughness, water contact angle and hardness of silicon, silicon dioxide and glass
AU Alam, MMR Howlader, MJ Deen
Journal of Micromechanics and Microengineering 24 (3), 035010, 2014
1532014
Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding
AU Alam, MMR Howlader, MJ Deen
ECS Journal of Solid State Science and Technology 2 (12), P515-P523, 2013
1512013
Integrated water quality monitoring system with pH, free chlorine, and temperature sensors
Y Qin, AU Alam, S Pan, MMR Howlader, R Ghosh, NX Hu, H Jin, S Dong, ...
Sensors and Actuators B: Chemical 255, 781-790, 2018
1172018
Inkjet Printing of a Highly Loaded Palladium Ink for Integrated, Low-Cost pH Sensors
Y Qin, AU Alam, MMR Howlader, NX Hu, MJ Deen
Advanced Functional Materials, 2016
1062016
Room temperature wafer level glass/glass bonding
MMR Howlader, S Suehara, T Suga
Sensors and Actuators A: Physical 127 (1), 31-36, 2006
1042006
Glutamate Sensing in Biofluids: Recent Advances and Research Challenges of Electrochemical Sensors
J Schultz, Z Uddin, G Singh, MMR Howlader
Analyst, 2019
99*2019
Fabrication of highly sensitive Bisphenol A electrochemical sensor amplified with chemically modified multiwall carbon nanotubes and β-cyclodextrin
YM Ali, AU Alam, MMR Howlader
Sensors and Actuators B, 2020
962020
Wafer level surface activated bonding tool for MEMS packaging
MMR Howlader, H Okada, TH Kim, T Itoh, T Suga
Journal of The Electrochemical Society 151 (7), G461-G467, 2004
882004
Tailoring MWCNTs and β-Cyclodextrin for Sensitive Detection of Acetaminophen and Estrogen
AU Alam, Y Qin, M Catalano, L Wang, MJ Kim, MMR Howalder, NX Hu, ...
ACS Appl Mater Interfaces, 2018
802018
Room temperature bonding of silicon and lithium niobate
MMR Howlader, T Suga, MJ Kim
Applied physics letters 89 (3), 2006
792006
Room-temperature microfluidics packaging using sequential plasma activation process
MMR Howlader, S Suehara, H Takagi, TH Kim, R Maeda, T Suga
IEEE transactions on advanced packaging 29 (3), 448-456, 2006
782006
Inkjet-printed bifunctional carbon nanotubes for pH sensing
Y Qin, HJ Kwon, A Subrahmanyam, MMR Howlader, PR Selvaganapathy, ...
Materials Letters 176, 68-70, 2016
752016
Nanobonding technology toward electronic, fluidic, and photonic systems integration
MMR Howlader, PR Selvaganapathy, MJ Deen, T Suga
IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 689-703, 2010
742010
Characterization of the bonding strength and interface current of p-Si/n-InP wafers bonded by surface activated bonding method at room temperature
MMR Howlader, T Watanabe, T Suga
Journal of applied physics 91 (5), 3062-3066, 2002
72*2002
Electrochemical sensing of lead in drinking water using β-cyclodextrin-modified MWCNTs
AU Alam, MMR Howlader, NX Hu, MJ Deen
Sensors and Actuators B: Chemical 296, 126632, 2019
712019
Das System kann den Vorgang jetzt nicht ausführen. Versuchen Sie es später erneut.
Artikel 1–20