| Power delivery design for 3-D ICs using different through-silicon via (TSV) technologies NH Khan, SM Alam, S Hassoun IEEE Transactions on Very Large Scale Integration (VLSI) Systems 19 (4), 647-658, 2010 | 162 | 2010 |
| System-level comparison of power delivery design for 2D and 3D ICs NH Khan, SM Alam, S Hassoun 2009 IEEE International Conference on 3D System Integration, 1-7, 2009 | 67 | 2009 |
| Through-silicon via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs NH Khan, SM Alam, S Hassoun 2009 IEEE International Conference on 3D System Integration, 1-7, 2009 | 48 | 2009 |
| Mitigating TSV-induced substrate noise in 3-D ICs using GND plugs NH Khan, SM Alam, S Hassoun 2011 12th International Symposium on Quality Electronic Design, 1-6, 2011 | 24 | 2011 |
| Designing TSVs for 3D integrated circuits N Khan, S Hassoun Springer Science & Business Media, 2012 | 17 | 2012 |
| Non-wood forest products of Bangladesh: an overview SA Khan, NA Khan Bangladesh J For Sci 23 (1), 45-50, 1994 | 14 | 1994 |
| GND plugs: A superior technology to mitigate TSV-induced substrate noise NH Khan, SM Alam, S Hassoun IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013 | 12 | 2013 |
| Effects of soil application of certain fungal and bacterial bioagents against Meloidogyne incognita infecting chick pea MR Khan, SM Khan, N Khan Proceedings of National congress on Centenary of Nematology in India …, 2001 | 11 | 2001 |
| Virtual worlds for young people in a program context: Lessons from four case studies MU Bers, L Beals, C Chau, K Satoh, N Khan New science of learning: Cognition, computers and collaboration in education …, 2010 | 10 | 2010 |
| Early estimation of TSV area for power delivery in 3-D integrated circuits NH Khan, S Reda, S Hassoun 2010 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2010 | 9 | 2010 |
| The feasibility of Carbon Nanotubes for power delivery in 3-D Integrated Circuits NH Khan, S Hassoun 17th Asia and South Pacific Design Automation Conference, 53-58, 2012 | 6 | 2012 |
| Screening of mungbean cultivars against increasing inoculum levels of Rhizoctonia solani. N Khan, MR Khan | 5 | 2001 |
| Fatal sepsis due to Pseudomonas cepacia. SK Saha, M Hanif, WA Khan, D Rahaman, N Khan, MS Hoq, G Sarwardi Singapore medical journal 35 (5), 475-476, 1994 | 4 | 1994 |
| Method to mitigate through-silicon via-induced substrate noise NH Kahn, S Hassoun, SM Alam US Patent App. 14/004,472, 2014 | 3 | 2014 |
| Effect of various NPK levels on green fodder yield of berseem S Khan, N Khan Sarhad Journal of Agriculture (Pakistan) 2 (4), 1986 | 3 | 1986 |
| Through-silicon via analysis for the design of 3-D integrated circuits NH Khan Tufts University, 2011 | 2 | 2011 |
| A distributed application model for mobile networks NH Khan, S Khan, MO Cheema, MN Ayyaz 7th International Multi Topic Conference, 2003. INMIC 2003., 157-163, 2003 | 2 | 2003 |
| 104P Pathologic tumor response & long term outcome with neoadjuvant trastuzumab in Her-2 positive breast cancer S Zeeshan, SM Khan, N Khan Annals of Oncology 27, ix31, 2016 | 1 | 2016 |
| Chemosterilization of Dacus cucurbitae Coq. S Khan, NH Khan | 1 | 1976 |
| Bio-efficacy of herbicides against different weed flora of wheat in central plain zone of Uttar Pradesh MZ Siddiqui, RA Yadav, N Khan, GS Parihar, A Kumar Annals of Agricultural Research 37 (2), 2016 | | 2016 |
