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Andriy Yakymovych
Andriy Yakymovych
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Zitiert von
Zitiert von
Jahr
Density, viscosity, and electrical conductivity of hypoeutectic Al-Cu liquid alloys
Y Plevachuk, V Sklyarchuk, A Yakymovych, S Eckert, B Willers, ...
Metallurgical and Materials Transactions A 39, 3040-3045, 2008
1152008
Electronic properties and viscosity of liquid Pb–Sn alloys
Y Plevachuk, V Sklyarchuk, A Yakymovych, B Willers, S Eckert
Journal of alloys and compounds 394 (1-2), 63-68, 2005
802005
Morphology and shear strength of lead-free solder joints with Sn3. 0Ag0. 5Cu solder paste reinforced with ceramic nanoparticles
A Yakymovych, Y Plevachuk, P Švec, P Švec, D Janičkovič, P Šebo, ...
Journal of Electronic Materials 45, 6143-6149, 2016
452016
Influence of doping with Ni on viscosity of liquid Al
S Mudry, V Sklyarchuk, A Yakymovych
Журнал фізичних досліджень, 1601-1-1601-5, 2008
422008
Structure sensitive properties of liquid Al–Si alloys
V Sklyarchuk, Y Plevachuk, A Yakymovych, S Eckert, G Gerbeth, ...
International Journal of Thermophysics 30, 1400-1410, 2009
412009
Sn–Ag–Cu nanosolders: melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system
A Roshanghias, J Vrestal, A Yakymovych, KW Richter, H Ipser
Calphad 49, 101-109, 2015
382015
Calorimetric studies of Cu–Li, Li–Sn, and Cu–Li–Sn
S Fürtauer, E Tserenjav, A Yakymovych, H Flandorfer
The Journal of chemical thermodynamics 61, 105-116, 2013
362013
Viscosity and structure of liquid Cu–In alloys
S Mudry, A Korolyshyn, V Vus, A Yakymovych
Journal of Molecular Liquids 179, 94-97, 2013
342013
Viscosity of Bi–Zn liquid alloys
S Mudry, Y Plevachuk, V Sklyarchuk, A Yakymovych
Journal of non-crystalline solids 354 (35-39), 4415-4417, 2008
312008
Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8 Ag–0.7 Cu solders by adding Co nanoparticles
A Yakymovych, Y Plevachuk, P Švec, D Janičkovič, P Šebo, N Beronska, ...
Journal of Materials Science: Materials in Electronics 28, 10965-10973, 2017
302017
Nanocomposite SAC solders: the effect of adding Ni and Ni-Sn nanoparticles on morphology and mechanical properties of Sn-3.0 Ag-0.5 Cu solders
A Yakymovych, P Švec, L Orovcik, O Bajana, H Ipser
Journal of electronic materials 47, 117-123, 2018
292018
Synthesis and thermal behavior of tin-based alloy (Sn–Ag–Cu) nanoparticles
A Roshanghias, A Yakymovych, J Bernardi, H Ipser
Nanoscale 7 (13), 5843-5851, 2015
292015
Effect of nano Co reinforcements on the structure of the Sn-3.0 Ag-0.5 Cu solder in liquid and after reflow solid states
A Yakymovych, S Mudry, I Shtablavyi, H Ipser
Materials Chemistry and Physics 181, 470-475, 2016
272016
Enthalpy effect of adding cobalt to liquid Sn-3.8 Ag-0.7 Cu lead-free solder alloy: difference between bulk and nanosized cobalt
A Yakymovych, G Kaptay, A Roshanghias, H Flandorfer, H Ipser
The Journal of Physical Chemistry C 120 (3), 1881-1890, 2016
272016
Synthesis and characterization of pure Ni and Ni-Sn intermetallic nanoparticles
A Yakymovych, H Ipser
Nanoscale Research Letters 12, 1-7, 2017
252017
Microsegregation in liquid Pb-based eutectics
Y Plevachuk, V Sklyarchuk, A Yakymovych, G Gerbeth
Journal of non-crystalline solids 354 (35-39), 4443-4447, 2008
242008
Structural studies of liquid Co–Sn alloys
A Yakymovych, I Shtablavyi, S Mudry
Journal of alloys and compounds 610, 438-442, 2014
222014
Hybrid solder joints: morphology and shear strength of Sn–3.0 Ag–0.5 Cu solder joints by adding ceramic nanoparticles through flux doping
A Aspalter, A Cerny, M Göschl, M Podsednik, G Khatibi, A Yakymovych, ...
Applied Nanoscience 10, 4943-4949, 2020
202020
Enthalpy of mixing of liquid Co–Sn alloys
A Yakymovych, S Fürtauer, A Elmahfoudi, H Ipser, H Flandorfer
The Journal of Chemical Thermodynamics 74, 269-285, 2014
202014
Viscosity of liquid Co–Sn alloys: thermodynamic evaluation and experiment
A Yakymovych, Y Plevachuk, S Mudry, J Brillo, H Kobatake, H Ipser
Physics and Chemistry of Liquids 52 (4), 562-570, 2014
192014
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