Interfacial reactions between lead-free solders and common base materials T Laurila, V Vuorinen, JK Kivilahti
Materials Science and Engineering: R: Reports 49 (1-2), 1-60, 2005
1267 2005 Thermodynamics, diffusion and the Kirkendall effect in solids A Paul, T Laurila, V Vuorinen, SV Divinski
Springer International Publishing, 2014
462 2014 Piezoelectric coefficients and spontaneous polarization of ScAlN MA Caro, S Zhang, T Riekkinen, M Ylilammi, MA Moram, ...
Journal of Physics: Condensed Matter 27 (24), 245901, 2015
397 2015 Impurity and alloying effects on interfacial reaction layers in Pb-free soldering T Laurila, V Vuorinen, M Paulasto-Kröckel
Materials Science and Engineering: R: Reports 68 (1-2), 1-38, 2010
382 2010 Cycle aging of commercial NMC/graphite pouch cells at different temperatures K Jalkanen, J Karppinen, L Skogström, T Laurila, M Nisula, K Vuorilehto
Applied Energy 154, 160-172, 2015
323 2015 Reactive sputter deposition and properties of TaxN thin films T Riekkinen, J Molarius, T Laurila, A Nurmela, I Suni, JK Kivilahti
Microelectronic Engineering 64 (1-4), 289-297, 2002
224 2002 Hybrid carbon based nanomaterials for electrochemical detection of biomolecules T Laurila, S Sainio, MA Caro
Progress in Materials Science 88, 499-594, 2017
184 2017 Growth Mechanism and Origin of High MA Caro, VL Deringer, J Koskinen, T Laurila, G Csányi
Physical review letters 120 (16), 166101, 2018
183 2018 Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers T Laurila, J Hurtig, V Vuorinen, JK Kivilahti
Microelectronics Reliability 49 (3), 242-247, 2009
134 2009 Understanding X-ray spectroscopy of carbonaceous materials by combining experiments, density functional theory, and machine learning. Part I: Fingerprint spectra A Aarva, VL Deringer, S Sainio, T Laurila, MA Caro
Chemistry of Materials 31 (22), 9243-9255, 2019
117 2019 Failure mechanism of Ta diffusion barrier between Cu and Si T Laurila, K Zeng, JK Kivilahti, J Molarius, I Suni
Journal of Applied Physics 88 (6), 3377-3384, 2000
115 2000 Micro-and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging: Volume I Materials physics-materials mechanics. Volume II Physical … E Suhir, YC Lee, CP Wong
Springer, 2007
114 2007 Electrochemical fouling of dopamine and recovery of carbon electrodes E Peltola, S Sainio, KB Holt, T Palomaki, J Koskinen, T Laurila
Analytical chemistry 90 (2), 1408-1416, 2018
110 2018 Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations V Vuorinen, H Yu, T Laurila, JK Kivilahti
Journal of Electronic Materials 37, 792-805, 2008
110 2008 Reactivity of amorphous carbon surfaces: rationalizing the role of structural motifs in functionalization using machine learning MA Caro, A Aarva, VL Deringer, G Csányi, T Laurila
Chemistry of Materials 30 (21), 7446-7455, 2018
104 2018 Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests T Laurila, T Mattila, V Vuorinen, J Karppinen, J Li, M Sippola, JK Kivilahti
Microelectronics Reliability 47 (7), 1135-1144, 2007
102 2007 Heat generation in high power prismatic Li‐ion battery cell with LiMnNiCoO2 cathode material Y Abdul‐Quadir, T Laurila, J Karppinen, K Jalkanen, K Vuorilehto, ...
International Journal of Energy Research 38 (11), 1424-1437, 2014
101 2014 Solid-state reactions between Cu (Ni) alloys and Sn V Vuorinen, T Laurila, T Mattila, E Heikinheimo, JK Kivilahti
Journal of Electronic Materials 36, 1355-1362, 2007
99 2007 Computational surface chemistry of tetrahedral amorphous carbon by combining machine learning and density functional theory VL Deringer, MA Caro, R Jana, A Aarva, SR Elliott, T Laurila, G Csányi, ...
Chemistry of Materials 30 (21), 7438-7445, 2018
89 2018 Tantalum carbide and nitride diffusion barriers for Cu metallisation T Laurila, K Zeng, JK Kivilahti, J Molarius, T Riekkinen, I Suni
Microelectronic Engineering 60 (1-2), 71-80, 2002
88 2002 
Vesa VuorinenAalto UniversityBestätigte E-Mail-Adresse bei tkk.fi
