| Test-access mechanism optimization for core-based three-dimensional SOCs X Wu, Y Chen, K Chakrabarty, Y Xie Microelectronics Journal 41 (10), 601-615, 2010 | 147 | 2010 |
| Cost-effective integration of three-dimensional (3D) ICs emphasizing testing cost analysis Y Chen, D Niu, Y Xie, K Chakrabarty 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 471-476, 2010 | 87 | 2010 |
| 3D-NonFAR: Three-dimensional non-volatile FPGA architecture using phase change memory Y Chen, J Zhao, Y Xie Proceedings of the 16th ACM/IEEE international symposium on Low power …, 2010 | 74 | 2010 |
| Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs Y Chen, E Kursun, D Motschman, C Johnson, Y Xie IEEE/ACM International Symposium on Low Power Electronics and Design, 397-402, 2011 | 42 | 2011 |
| Through silicon via aware design planning for thermally efficient 3-D integrated circuits Y Chen, E Kursun, D Motschman, C Johnson, Y Xie IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013 | 37 | 2013 |
| Variation-aware task and communication mapping for mpsoc architecture F Wang, Y Chen, C Nicopoulos, X Wu, Y Xie, N Vijaykrishnan IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2011 | 37 | 2011 |
| Arithmetic unit design using 180nm TSV-based 3D stacking technology J Ouyang, G Sun, Y Chen, L Duan, T Zhang, Y Xie, MJ Irwin 2009 IEEE International Conference on 3D System Integration, 1-4, 2009 | 37 | 2009 |
| Tolerating process variations in high-level synthesis using transparent latches Y Chen, Y Xie 2009 Asia and South Pacific Design Automation Conference, 73-78, 2009 | 24 | 2009 |
| Design and implementation of a wifi-based local locating system Y Chen, R Luo 2007 IEEE International Conference on Portable Information Devices, 1-5, 2007 | 21 | 2007 |
| Statistical high-level synthesis under process variability Y Xie, Y Chen IEEE Design & Test of Computers 26 (4), 78-87, 2009 | 19 | 2009 |
| Minimizing leakage power in aging-bounded high-level synthesis with design time multi-Vth assignment Y Chen, Y Xie, Y Wang, A Takach 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC), 689-694, 2010 | 18 | 2010 |
| 3DHLS: Incorporating high-level synthesis in physical planning of three-dimensional (3D) ICs Y Chen, G Sun, Q Zou, Y Xie 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2012 | 11 | 2012 |
| Three-dimensional integrated circuits: Design, eda, and architecture G Sun, Y Chen, X Dong, J Ouyang, Y Xie Foundations and Trends® in Electronic Design Automation 5 (1–2), 1-151, 2011 | 9 | 2011 |
| ILP-based scheme for timing variation-aware scheduling and resource binding Y Chen, J Ouyang, Y Xie 2008 IEEE International SOC Conference, 27-30, 2008 | 8 | 2008 |
| Parametric yield driven resource binding in behavioral synthesis with multi-Vth/Vdd library Y Chen, Y Xie, Y Wang, A Takach 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC), 781-786, 2010 | 6 | 2010 |
| Energy and performance driven circuit design for emerging Phase-Change Memory D Niu, Y Chen, X Dong, Y Xie 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC), 193-198, 2010 | 5 | 2010 |
| System-level design space exploration for three-dimensional (3D) SoCs Q Zou, Y Chen, Y Xie, A Su Proceedings of the seventh IEEE/ACM/IFIP international conference on …, 2011 | 4 | 2011 |
| Test-access solutions for three-dimensional SOCs X Wu, Y Chen, K Chakrabarty, Y Xie 2008 IEEE International Test Conference, 1-1, 2008 | 4 | 2008 |
| A system level fine-grained dynamic voltage and frequency scaling for portable embedded systems with multiple frequency adjustable components K He, Y Chen, R Luo 2007 IEEE International Conference on Portable Information Devices, 1-5, 2007 | 3 | 2007 |
| Parametric yield-driven resource binding in high-level synthesis with multi-Vth/Vdd library and device sizing Y Chen, Y Wang, Y Xie, A Takach Journal of Electrical and Computer Engineering 2012, 2012 | 2 | 2012 |
Yu Wang (汪玉)Department of Electronic Engineering, Tsinghua University, ChinaBestätigte E-Mail-Adresse bei mail.tsinghua.edu.cn