| Development of a thermal resistance model for chip-on-board packaging of high power LED arrays M Ha, S Graham Microelectronics Reliability 52 (5), 836-844, 2012 | 179 | 2012 |
| Pool boiling characteristics and critical heat flux mechanisms of microporous surfaces and enhancement through structural modification M Ha, S Graham Applied Physics Letters 111 (9), 2017 | 61 | 2017 |
| Thermal management methods for compact high power LED arrays A Christensen, M Ha, S Graham Seventh International Conference on Solid State Lighting 6669, 192-210, 2007 | 61 | 2007 |
| Thermal analysis of high power LED arrays MS Ha Georgia Institute of Technology, 2009 | 38 | 2009 |
| Pool boiling enhancement using vapor channels in microporous surfaces M Ha, S Graham International Journal of Heat and Mass Transfer 143, 118532, 2019 | 36 | 2019 |
| Measuring the thermal resistance in light emitting diodes using a transient thermal analysis technique S Natarajan, M Ha, S Graham IEEE transactions on electron devices 60 (8), 2548-2555, 2013 | 17 | 2013 |
| Pool boiling enhancement through hierarchical texturing of surfaces M Ha, S Graham 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 16 | 2016 |
| Corrosion in Liquid Cooling Systems with Water-Based Coolant–Part 2: Corrosion Reliability Testing and Failure Model CU Kim, G Ni, G Kini, JY Chang, A Saha, A Antoniswamy, I Klein, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 11 | 2020 |
| Thermal management of high density power servers using a compact two-phase loop cooling system J Choi, M Ha, Y Lee, S Graham, H Kang 29th IEEE Semiconductor Thermal Measurement and Management Symposium, 29-32, 2013 | 9 | 2013 |
| Corrosion in Liquid Cooling Systems with Water-Based Coolant–Part 1: Flow Loop Design for Reliability Tests G Kini, CU Kim, H Madanipour, JY Chang, A Saha, A Antoniswamy, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 8 | 2020 |
| Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies A Uppal, JY Chang, W Tang, M Ha US Patent 11,664,294, 2023 | 4 | 2023 |
| Mechanical Texturing of Microporous Surfaces To Enhance Pool Boiling Heat Transfer M Ha Georgia Institute of Technology, 2018 | 2 | 2018 |
| Evaporator for looped heat pipe system and method of manufacturing the same JH Choi, YK Lee, MW Seo, MS HA US Patent App. 13/768,244, 2014 | 1 | 2014 |
