| A review and methodology development for remaining useful life prediction of offshore fixed and floating wind turbine power converter with digital twin technology perspective K Sivalingam, M Sepulveda, M Spring, P Davies 2018 2nd international conference on green energy and applications (ICGEA …, 2018 | 236 | 2018 |
| A Review on the Evolution of Darrieus Vertical Axis Wind Turbine: Small Wind Turbines HW Palanisamy Mohan Kumar1,2*, Krishnamoorthi Sivalingam2,3, Srikanth ... Journal of Power and Energy Engineering 7 (No.4, April 2019), 27-44, 2019 | 59 | 2019 |
| Review on the evolution of Darrieus vertical axis wind turbine: Large wind turbines P Mohan Kumar, K Sivalingam, TC Lim, S Ramakrishna, H Wei Clean technologies 1 (1), 205-223, 2019 | 31 | 2019 |
| Development of a new improved high performance flip chip BGA package DYR Chong, BK Lim, KJ Rebibis, SJ Pan, S Krishnamoorthi, R Kapoor, ... 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 31 | 2004 |
| Strategies for enhancing the low wind speed performance of H-Darrieus wind turbine—Part 1 P Mohan Kumar, K Sivalingam, TC Lim, S Ramakrishna, H Wei Clean Technologies 1 (1), 185-204, 2019 | 28 | 2019 |
| Yuan-Hu Zhi tong prescription mitigates tau pathology and alleviates memory deficiency in the preclinical models of Alzheimer’s Disease A Iyaswamy, SK Krishnamoorthi, YW Liu, JX Song, AK Kammala, ... Frontiers in Pharmacology 11, 584770, 2020 | 25 | 2020 |
| Numerical Validation of Floating Offshore Wind Turbine Scaled Rotor for Surge Motion K Sivalingam, S Martin, AAS Wala MDPI Energies, 2018 | 24 | 2018 |
| Thermal characterization of a thermally enhanced QFN package S Krishnamoorthi, KY Goh, DYR Chong, R Kapoor, AYS Sun Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003 | 19 | 2003 |
| Computational optimization of adaptive hybrid Darrieus turbine: Part 1 P Mohan Kumar, MR Surya, K Sivalingam, TC Lim, S Ramakrishna, H Wei Fluids 4 (2), 90, 2019 | 16 | 2019 |
| Structurally-enhanced integrated circuit package and method of manufacture RK Kolan, HB Tan, AYS Sun, BK Lim, K Sivalingam US Patent 7,830,006, 2010 | 16 | 2010 |
| Thermal management and characterization of flip chip BGA packages S Krishnamoorthi, DYR Chong, AYS Sun Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004 …, 2004 | 15 | 2004 |
| Development of high power QFN package FP KS, TH Boon, K Sivalingam, LB Kuan, AYS Sun, R Bidin IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology …, 2004 | 13 | 2004 |
| Effects of platform pitching motion on Floating Offshore Wind Turbine (FOWT) rotor K Sivalingam, A Bahuguni, J Gullman-Strand, P Davies, V Tan NGUYEN Offshore Technology Conference, OTC-25962-MS, 2015 | 10 | 2015 |
| Strategies for enhancing the low wind speed performance of H-Darrieus wind turbine—Part 1 PM Kumar, K Sivalingam, TC Lim, S Ramakrishna, H Wei Clean Technol. 1 (1), 1-20, 2019 | 9 | 2019 |
| Wind turbine with a refrigeration system and a method of providing cooling of a heat generating component in a nacelle for a wind turbine JK Grevsen, S Narasimalu, J Nyvad, PT Tietze, A Bahuguni, K Sivalingam US Patent 7,967,550, 2011 | 9 | 2011 |
| Implementation of computational methods to obtain accurate induction factors for offshore wind turbines A Bahuguni, K Sivalingam, P Davies, J Gullman-Strand, VT Nguyen International Conference on Offshore Mechanics and Arctic Engineering 45547 …, 2014 | 8 | 2014 |
| Wind turbine nacelle with cooler top K Sivalingam, A Bahuguni, R Kandasamy, S Narasimalu, JK Grevsen, ... US Patent 9,039,369, 2015 | 7 | 2015 |
| Cooling system for a wind turbine PT Tietze, J Nyvad, A Bahuguni, R Kandasamy, K Sivalingam US Patent 8,206,112, 2012 | 7 | 2012 |
| Thermal evaluation of two die stacked FBGA packages S Krishnamoorthi, WH Zhu, CK Wang, HB Tan, AYS Sun 2007 9th Electronics Packaging Technology Conference, 278-284, 2007 | 7 | 2007 |
| On the thermal characterization of an exposed top quad flat no-lead package YY Ma, S Krishnamoorthi, CK Wang, AYS Sun, WH Zhu, HB Tan 2006 8th Electronics Packaging Technology Conference, 810-814, 2006 | 7 | 2006 |
