Method of stabilizing hydrogenated amorphous silicon and amorphous hydrogenated silicon alloys B Hekmatshoar-Tabari, M Hopstaken, DG Park, DK Sadana, GG Shahidi, ...
US Patent 8,778,448, 2014
476 2014 Method of stabilizing hydrogenated amorphous silicon and amorphous hydrogenated silicon alloys B Hekmatshoar-Tabari, M Hopstaken, DG Park, DK Sadana, GG Shahidi, ...
US Patent 9,099,585, 2015
474 2015 METHOD OF PE-ALD OF SiNxCy AND INTEGRATION OF LINER MATERIALS ON POROUS LOW K SUBSTRATES AJ Kellock, H Kim, DG Park, SV Nitta, S Purushothaman, S Rossnagel, ...
US Patent App. 12/203,338, 2010
471 2010 Sharp reduction of contact resistivities by effective Schottky barrier lowering with silicides as diffusion sources Z Zhang, F Pagette, C D'emic, B Yang, C Lavoie, Y Zhu, M Hopstaken, ...
IEEE Electron Device Letters 31 (7), 731-733, 2010
311 2010 High- /Metal-Gate Fully Depleted SOI CMOS With Single-Silicide Schottky Source/Drain With Sub-30-nm Gate Length MH Khater, Z Zhang, J Cai, C Lavoie, C D'Emic, Q Yang, B Yang, ...
IEEE Electron Device Letters 31 (4), 275-277, 2010
264 2010 Method of forming a metal gate in a semiconductor device using atomic layer deposition process 2007 DG Park, HJ Cho, KY Lim - US Patent 7,157,359
US Patent 20,020,086,507, 0
193 * Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition H Kim, C Detavenier, O Van der Straten, SM Rossnagel, AJ Kellock, ...
Journal of applied physics 98 (1), 2005
162 2005 Characteristics of n {sup+} polycrystalline-Si/Al {sub 2} O {sub 3}/Si metal {endash} oxide {endash} semiconductor structures prepared by atomic layer chemical vapor deposition … DG Park, HJ Cho, KY Lim, C Lim, IS Yeo, JS Roh, JW Park
Journal of Applied Physics 89 (11), 2001
140 2001 A manufacturable dual channel (Si and SiGe) high-k metal gate CMOS technology with multiple oxides for high performance and low power applications S Krishnan, U Kwon, N Moumen, MW Stoker, ECT Harley, S Bedell, ...
2011 International Electron Devices Meeting, 28.1. 1-28.1. 4, 2011
129 2011 High-performance high-κ/metal gates for 45nm CMOS and beyond with gate-first processing M Chudzik, B Doris, R Mo, J Sleight, E Cartier, C Dewan, D Park, H Bu, ...
2007 IEEE symposium on VLSI technology, 194-195, 2007
122 2007 Method of manufacturing semiconductor devices with titanium aluminum nitride work function DG Park, TH Cha, SA Jang, HJ Cho, TK Kim, KY Lim, IS Yeo, JW Park
US Patent 6,506,676, 2003
105 2003 Characteristics of n+ polycrystalline-Si/Al 2 O 3/Si metal–oxide–semiconductor structures prepared by atomic layer chemical vapor deposition using Al (CH 3) 3 and H 2 O vapor DG Park, HJ Cho, KY Lim, C Lim, IS Yeo, JS Roh, JW Park
Journal of Applied Physics 89 (11), 6275-6280, 2001
103 2001 finFETS and methods of making same KK Chan, TS Kanarsky, J Li, CQ Ouyang, DG Park, Z Ren, X Wang, H Yin
US Patent 8,043,920, 2011
99 2011 Electrical conduction in silicon nitrides deposited by plasma enhanced chemical vapour deposition M Tao, D Park, SN Mohammad, D Li, AE Botchkerav, H Morkoç
Philosophical Magazine B 73 (4), 723-736, 1996
89 1996 FinFET with longitudinal stress in a channel KK Chan, QC Ouyang, DG Park, X Wang
US Patent 7,872,303, 2011
86 2011 Gate quality Si3 N4 prepared by low temperature remote plasma enhanced chemical vapor deposition for III–V semiconductor‐based metal–insulator … DG Park, M Tao, D Li, AE Botchkarev, Z Fan, Z Wang, SN Mohammad, ...
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 1996
82 1996 Statistical measurement of random telegraph noise and its impact in scaled-down high-κ/metal-gate MOSFETs H Miki, N Tega, M Yamaoka, DJ Frank, A Bansal, M Kobayashi, K Cheng, ...
2012 International Electron Devices Meeting, 19.1. 1-19.1. 4, 2012
77 2012 Boron penetration in metal–oxide–semiconductor system DG Park, HJ Cho, IS Yeo, JS Roh, JM Hwang
Applied Physics Letters 77 (14), 2207-2209, 2000
74 2000 High-temperature stable gate structure with metallic electrode DG Park, OG Gluschenkov, MA Gribelyuk, KH Wong
US Patent 7,279,413, 2007
73 2007 Impact of atomic-layer-deposited TiN on the gate oxide quality of W/TiN/SiO2/Si metal–oxide–semiconductor structures DG Park, KY Lim, HJ Cho, TH Cha, IS Yeo, JS Roh, JW Park
Applied physics letters 80 (14), 2514-2516, 2002
69 2002