Ionic-surfactant-mediated electro-dewetting for digital microfluidics J Li, NS Ha, TL Liu, RM van Dam, CJ ‘CJ’Kim Nature 572 (7770), 507-510, 2019 | 238 | 2019 |
Current commercialization status of electrowetting-on-dielectric (EWOD) digital microfluidics J Li Lab on a Chip 20 (10), 1705-1712, 2020 | 204 | 2020 |
Open-source incubation ecosystem for digital microfluidics—Status and roadmap X Huang, CC Liang, J Li, TY Ho, CJ Kim 2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-6, 2019 | 17 | 2019 |
Low-cost and low-topography fabrication of multilayer interconnections for microfluidic devices J Li, S Chen, CJ Kim Journal of Micromechanics and Microengineering 30 (7), 077001, 2020 | 8 | 2020 |
A Versatile Control System for Digital Microfluidic Chips of Varying Types, Shapes, Sizes, and Thicknesses QL Wang, J Li, HSE Cho, L Xu, A Wang, S Kuiry, Z He, J Ho, CJCJ Kim 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems …, 2024 | 1 | 2024 |
Democratizing digital microfluidics by a cloud-based design and manufacturing platform QL Wang, EH Cho, J Li, HC Huang, S Kin, Y Piao, L Xu, K Tang, S Kuiry, ... Lab on a Chip 24 (19), 4536-4548, 2024 | 1 | 2024 |
Electrodewetting on Transparent Substrate: Device Fabrication and Demonstration J Li, CJ Kim 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems …, 2019 | 1 | 2019 |
A convenient method to fabricate multilayer interconnections for microdevices J Li, S Chen, CJ Kim 2015 28th IEEE International Conference on Micro Electro Mechanical Systems …, 2015 | 1 | 2015 |