| Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy J Chen, D Mu, X Liao, G Huang, H Huang, X Xu, H Huang International Journal of Refractory Metals and Hard Materials 74, 52-60, 2018 | 58 | 2018 |
| Microstructures and bonding strength of synthetic diamond brazed by near-eutectic Ag–Cu–in–Ti filler alloy Z Liu, X Liao, W Fu, D Mu, X Xu, H Huang Materials Science and Engineering: A 790, 139711, 2020 | 44 | 2020 |
| Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures X Liao, D Mu, J Wang, G Huang, H Huang, X Xu, H Huang International Journal of Refractory Metals and Hard Materials 66, 252-257, 2017 | 24 | 2017 |
| Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys X Liao, D Mu, W Fu, H Huang, H Huang Materials & Design 182, 108039, 2019 | 23 | 2019 |
| Dynamic model and machining mechanism of wire sawing Z Lai, H Huang, Z Hu, X Liao Journal of Materials Processing Technology 311, 117820, 2023 | 19 | 2023 |
| Investigation of the anisotropy of 4H-SiC materials in nanoindentation and scratch experiments S Shi, Y Yu, N Wang, Y Zhang, W Shi, X Liao, N Duan Materials 15 (7), 2496, 2022 | 19 | 2022 |
| Reactive wetting of binary SnCr alloy on polycrystalline chemical vapour deposited diamond at relatively low temperatures J Chen, X Liao, Q Lin, D Mu, H Huang, X Xu, H Huang Diamond and Related Materials 92, 92-99, 2019 | 18 | 2019 |
| Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond X Liao, Q He, Q Lin, D Mu, H Huang, H Huang Applied Surface Science 504, 144508, 2020 | 16 | 2020 |
| Microstructure evolution and joining strength of diamond brazed on Ti-6Al-4V substrates using Ti-free eutectic Ag-Cu filler alloy X Liao, Z Liu, R Liu, D Mu Diamond and Related Materials 127, 109198, 2022 | 11 | 2022 |
| Brazing sapphire/sapphire and sapphire/copper sandwich joints using Sn-Ag-Ti active solder alloy KY Feng, DK Mu, XJ Liao, H Huang, XP Xu Solid State Phenomena 273, 187-193, 2018 | 10 | 2018 |
| Experimental study on the formation mechanism of saw marks in wire sawing Z Lai, X Liao, H Yang, Z Hu, H Huang International Journal of Mechanical Sciences 265, 108894, 2024 | 9 | 2024 |
| Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite Y Zhang, X Liao, Q Lin, D Mu, J Lu, H Huang, H Huang Materials 13 (7), 1532, 2020 | 8 | 2020 |
| Wetting behaviours and interfacial characteristics of Co-binder sintered polycrystalline diamond by SnTi active solder Q He, Y Zhang, N Duan, H Huang, D Mu, X Liao Powder Technology 376, 643-651, 2020 | 5 | 2020 |
| Influence of cutting parameters on wear of diamond wire during multi-wire rocking sawing with reciprocating motion Z Yang, H Huang, X Liao Frontiers in Mechanical Engineering 8, 978714, 2022 | 4 | 2022 |
| Complex-shaped metal parts high efficiency sawing with diamond wire Z Xu, H Huang, C Cui, X Liao, M Wu, Z Xue International Journal of Mechanical Sciences 250, 108306, 2023 | 3 | 2023 |
| Wettability of Sn-Ti alloys on poly-crystalline CVD diamond plates XJ Liao, QQ He, DK Mu, H Huang, XP Xu Solid State Phenomena 273, 181-186, 2018 | 3 | 2018 |
| Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire Z Yang, H Huang, X Liao, Z Lai, Z Xu, Y Zhao Materials 17 (9), 2134, 2024 | 2 | 2024 |
| Wettability and Interface Reaction of Sn-Cr powder alloy on Poly-crystalline Diamond (PCD) J Chen, D Mu, X Liao, H Huang, X Xu IOP Conference Series: Materials Science and Engineering 423 (1), 012063, 2018 | 2 | 2018 |
| Microstructural insights and performance evaluation of low-damage brazed diamond wire with a tungsten core H Yang, H Huang, X Liao, Z Lai, N Duan, Z Xu International Journal of Refractory Metals and Hard Materials, 107081, 2025 | | 2025 |
| Three-dimensional dynamic model of wire sawing for saw marks control Z Lai, X Liao, Z Xu, Z Hu, H Huang International Journal of Mechanical Sciences 286, 109892, 2025 | | 2025 |
