| A review: On the development of low melting temperature Pb-free solders HR Kotadia, PD Howes, SH Mannan Microelectronics Reliability 54 (6-7), 1253-1273, 2014 | 501 | 2014 |
| Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects JF Li, SH Mannan, MP Clode, DC Whalley, DA Hutt Acta Materialia 54 (11), 2907-2922, 2006 | 244 | 2006 |
| Review of silver nanoparticle based die attach materials for high power/temperature applications SA Paknejad, SH Mannan Microelectronics Reliability 70, 1-11, 2017 | 228 | 2017 |
| Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates HR Kotadia, O Mokhtari, MP Clode, MA Green, SH Mannan Journal of Alloys and Compounds 511 (1), 176-188, 2012 | 130 | 2012 |
| Microstructure evolution during 300 C storage of sintered Ag nanoparticles on Ag and Au substrates SA Paknejad, G Dumas, G West, G Lewis, SH Mannan Journal of Alloys and Compounds 617, 994-1001, 2014 | 129 | 2014 |
| Materials and processes for implementing high-temperature liquid interconnects SH Mannan, MP Clode IEEE transactions on advanced packaging 27 (3), 508-514, 2004 | 73 | 2004 |
| Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan IEEE transactions on components and packaging technologies 25 (1), 87-97, 2002 | 73 | 2002 |
| The top quark condensate SF King, SH Mannan Physics Letters B 241 (2), 249-254, 1990 | 72 | 1990 |
| Conduction mechanisms in anisotropic conducting adhesive assembly CN Oguibe, SH Mannan, DC Whalley, DJ Williams Proceedings. The First IEEE International Symposium on Polymeric Electronics …, 1997 | 70 | 1997 |
| Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders JF Li, SH Mannan, MP Clode, K Chen, DC Whalley, C Liu, DA Hutt Acta Materialia 55 (2), 737-752, 2007 | 68 | 2007 |
| Reactions of Sn-3.5 Ag-based solders containing Zn and Al additions on Cu and Ni (P) substrates HR Kotadia, O Mokhtari, M Bottrill, MP Clode, MA Green, SH Mannan Journal of electronic materials 39, 2720-2731, 2010 | 61 | 2010 |
| Squeegee deformation study in the stencil printing of solder pastes SH Mannan, NN Ekere, I Ismail, EK Lo IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1994 | 59 | 1994 |
| Semi-active suspension system simulation using Simulink S Abramov, S Mannan, O Durieux International Journal of Engineering Systems Modelling and Simulation 1 (2-3 …, 2009 | 46 | 2009 |
| Synthesis and characterization of gold nanoshells using poly (diallyldimethyl ammonium chloride) R Ashayer, SH Mannan, S Sajjadi Colloids and Surfaces A: Physicochemical and Engineering Aspects 329 (3 …, 2008 | 45 | 2008 |
| Flow processes in solder paste during stencil printing for SMT assembly SH Mannan, NN Ekere, I Ismail, MA Currie Journal of Materials Science: Materials in Electronics 6, 34-42, 1995 | 37 | 1995 |
| High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles Y Zuo, S Carter-Searjeant, M Green, L Mills, SH Mannan Materials Letters 276, 128260, 2020 | 36 | 2020 |
| Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects PY Chia, ASMA Haseeb, SH Mannan Materials 9 (6), 430, 2016 | 35 | 2016 |
| Thermally stable high temperature die attach solution SA Paknejad, A Mansourian, Y Noh, K Khtatba, SH Mannan Materials & Design 89, 1310-1314, 2016 | 34 | 2016 |
| Quasi-in-situ observation of the grain growth and grain boundary movement in sintered Cu nanoparticle interconnects Y Zuo, C Zhao, A Robador, M Wickham, SH Mannan Acta Materialia 236, 118135, 2022 | 32 | 2022 |
| Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan IEEE transactions on components and packaging technologies 25 (1), 98-105, 2002 | 32 | 2002 |
