| Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration P Veselý, D Froš, M Klimtová, A Gharaibeh, B Medgyes 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2023 | 4 | 2023 |
| Electrochemical migration resistance of gold surface finishes M Klimtová, P Veselý, I Králová, YH Wong, MFM Sabri, K Dušek 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | 3 | 2024 |
| Solderless Component Assembly: Novel Ecological Approach to Electronics Production P Veselý, J Zdráhal, I Králová, M Klimtová, D Froš 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2023 | 3 | 2023 |
| Evaluation of Anisotropy of Additively Manufactured Structures M Klimtová, P Veselý 2021 44th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2021 | 3 | 2021 |
| Electrochemical migration issues related to improper solder mask application P Veselý, M Klimtová, D Froš 2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2022 | 2 | 2022 |
| Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type I Králová, D Pilnaj, O Pop-Georgievski, J Uřičář, P Veselý, M Klimtová, ... Applied Surface Science, 160447, 2024 | 1 | 2024 |
| Effect of TiO2 Nanoparticles Addition on the Electrochemical Migration of Lead-Free Sn-Bi Alloys A Dayoub, A Gharaibeh, P Tamási, P Veselý, M Klimtová, I Králová, ... 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | 1 | 2024 |
| Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes K Dušek, P Veselý, D Bušek, D Froš, I Králová, M Klimtová, D Pilnaj, ... 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | 1 | 2024 |
| Evaluation of Dendrite Growth between Electrodes with Different Shapes and Voltage Polarity M Klimtová, I Králová 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-5, 2023 | 1 | 2023 |
| Impact of Added Gallium and Phosphorus in Bismuth-Tin Solder Alloys on Mechanical Properties and Microstructure of Intermetallic Layer I Králová, M Klimtovà, P Veselý 2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-7, 2022 | 1 | 2022 |
| Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards M Klimtová, P Veselý, I Králová, K Dušek Materials 17 (17), 4242, 2024 | | 2024 |
| Electrochemical Migration: What Happens If a Drink Is Spilled on a Computer? P Veselý, J Šenkýř, M Klimtová, K Dušek 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | | 2024 |
| Effects of Thermal Cycling and PCB Substrate Type on Reliability of Solder Joints D Froš, M Klimtová, I Králová 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | | 2024 |
| 3D Printed Circuit Boards from Recycled Plastics: Interconnection Properties J Zdráhal, M Klimtová, I Králová 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | | 2024 |
| Methodology for Solderability Measurement of Plated Through Holes Using Wetting Balance Test I Králová, M Klimtová, P Veselý 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2023 | | 2023 |
| A Weakness of Wetting Balance Method during the Diagnostic of Connector Pins with Wetting Issue K Dušek, P Veselý, D Froš, M Kozák, K Sorokina, Z Plachý, D Bušek, ... 2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-5, 2022 | | 2022 |
| Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading M Klimtová, I Králová, P Veselý 2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-5, 2022 | | 2022 |
Petr VeselýCzech Technical University in Prague, Faculty of Electrical EngineeringΗ διεύθυνση ηλεκτρονικού ταχυδρομείου έχει επαληθευτεί στον τομέα fel.cvut.cz
