Παρακολούθηση
Tengbo Ma
Tengbo Ma
Η διεύθυνση ηλεκτρονικού ταχυδρομείου έχει επαληθευτεί στον τομέα mail.nwpu.edu.cn
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Παρατίθεται από
Παρατίθεται από
Έτος
Significantly enhanced and precisely modeled thermal conductivity in polyimide nanocomposites with chemically modified graphene via in situ polymerization and electrospinning …
Y Guo, G Xu, X Yang, K Ruan, T Ma, Q Zhang, J Gu, Y Wu, H Liu, Z Guo
Journal of Materials Chemistry C 6 (12), 3004-3015, 2018
4142018
A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods
X Yang, C Liang, T Ma, Y Guo, J Kong, J Gu, M Chen, J Zhu
Advanced composites and hybrid materials 1, 207-230, 2018
3472018
Self-healing, recoverable epoxy elastomers and their composites with desirable thermal conductivities by incorporating BN fillers via in-situ polymerization
X Yang, Y Guo, X Luo, N Zheng, T Ma, J Tan, C Li, Q Zhang, J Gu
Composites Science and Technology 164, 59-64, 2018
3042018
Highly thermal conductivities, excellent mechanical robustness and flexibility, and outstanding thermal stabilities of aramid nanofiber composite papers with nacre-mimetic …
T Ma, Y Zhao, K Ruan, X Liu, J Zhang, Y Guo, X Yang, J Kong, J Gu
ACS Applied Materials & Interfaces 12 (1), 1677-1686, 2020
3002020
Significant improvement of thermal conductivities for BNNS/PVA composite films via electrospinning followed by hot-pressing technology
X Yang, Y Guo, Y Han, Y Li, T Ma, M Chen, J Kong, J Zhu, J Gu
Composites Part B: Engineering 175, 107070, 2019
2462019
Thermally Conductive Poly (lactic acid) Composites with Superior Electromagnetic Shielding Performances via 3D Printing Technology
TB Ma, H Ma, KP Ruan, XT Shi, H Qiu, SY Gao, JW Gu
Chinese Journal of Polymer Science, 248–255, 2022
1832022
Improvement of thermal conductivities and simulation model for glass fabrics reinforced epoxy laminated composites via introducing hetero-structured BNN-30@ BNNS fillers
X Shi, R Zhang, K Ruan, T Ma, Y Guo, J Gu
Journal of Materials Science & Technology 82, 239-249, 2021
1822021
Significant reduction of interfacial thermal resistance and phonon scattering in graphene/polyimide thermally conductive composite films for thermal management
K Ruan, Y Guo, C Lu, X Shi, T Ma, Y Zhang, J Kong, J Gu
Research, 8438614, 2021
1562021
Constructing fully carbon-based fillers with a hierarchical structure to fabricate highly thermally conductive polyimide nanocomposites
Y Guo, K Ruan, X Yang, T Ma, J Kong, N Wu, J Zhang, J Gu, Z Guo
Journal of Materials Chemistry C 7 (23), 7035-7044, 2019
1532019
Fabrication, proposed model and simulation predictions on thermally conductive hybrid cyanate ester composites with boron nitride fillers
Y Li, G Xu, Y Guo, T Ma, X Zhong, Q Zhang, J Gu
Composites Part A: Applied Science and Manufacturing 107, 570-578, 2018
1122018
Advances in 3D printing for polymer composites: A review
T Ma, Y Zhang, K Ruan, H Guo, M He, X Shi, Y Guo, J Kong, J Gu
InfoMat, e12568, 2024
1012024
Controlled length and number of thermal conduction pathways for copper wire/poly (lactic acid) composites via 3D printing
T Ma, K Ruan, Y Guo, Y Han, J Gu
Science China Materials 10 (66), 4012-4021, 2023
492023
Theories and mechanisms of thermal conduction
T Ma, K Ruan, J Gu
Thermally Conductive Polymer Composites, 57, 2023
12023
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