Παρακολούθηση
Wei Zhang
Wei Zhang
PhD of Electrical Engineering, Missouri University of Science and Technology; Marvell Semiconductor
Η διεύθυνση ηλεκτρονικού ταχυδρομείου έχει επαληθευτεί στον τομέα mst.edu
Τίτλος
Παρατίθεται από
Παρατίθεται από
Έτος
A simple miniature ultrawideband magnetic field probe design for magnetic near-field measurements
Z Yan, J Wang, W Zhang, Y Wang, J Fan
IEEE transactions on antennas and propagation 64 (12), 5459-5465, 2016
1122016
A miniature ultrawideband electric field probe based on coax-thru-hole via array for near-field measurement
Z Yan, J Wang, W Zhang, Y Wang, J Fan
IEEE Transactions on Instrumentation and Measurement 66 (10), 2762-2770, 2017
862017
EMI prediction of multiple radiators
J Meiguni, W Zhang, M Soerensen, K Ghosh, A Hosseinbeig, A Patnaik, ...
IEEE Transactions on Electromagnetic Compatibility 62 (2), 415-424, 2019
172019
Growth of radiated emission in multi-modular systems
K Ghosh, W Zhang, J Meiguni, A Patnaik, D Pommerenke, P Sochoux, ...
IEEE Transactions on Electromagnetic Compatibility 62 (2), 612-616, 2019
92019
System-Level EMI of an artificial router system with multiple radiators: prediction and validation
W Zhang, JS Meiguni, K Ghosh, A Patnaik, M Sørensen, A Hosseinbeig, ...
IEEE Transactions on Electromagnetic Compatibility 62 (4), 1601-1610, 2020
72020
Design of an artificial dummy for human metal model ESD
GX Luo, K Huang, JC Zhou, W Zhang, D Pommerenke, J Holliman
IEEE Transactions on Electromagnetic Compatibility 63 (1), 319-323, 2020
72020
System level EMC for multiple EMI sources
J Meiguni, M Soerensen, W Zhang, A Hosseinbeig, D Pommerenke, ...
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019
72019
Systematic evaluation of soft failures in system-level ESD transient events
A Patnaik, W Zhang, R Hua, L Chuang, A Huang, H Lin, BC Tseng, ...
IEEE Transactions on Electromagnetic Compatibility 60 (5), 1263-1269, 2018
72018
Research on the transmission and coupling issue of multilayer TSV and multilayer TSV array
T Kang, Z Yan, W Zhang, J Wang
2015 IEEE 6th International Symposium on Microwave, Antenna, Propagation …, 2015
52015
A SPICE-compatible model to simulate RFI-Induced buzz noise problem in a camera
W Zhang, S Xia, X Fang, X Wang, T Enomoto, H Shumiya, K Araki, ...
IEEE Transactions on Electromagnetic Compatibility 64 (4), 987-998, 2022
42022
Radiated Emission Tests for High-frequency Router Systems in Class A: Discussion and Improvement
W Zhang, Z Peng, X Wang, DH Kim, J Drewniak
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 119-124, 2021
42021
An effective method of near to far field transformation based on dipoles model
J Wang, Z Yan, W Zhang, T Kang, M Zhang
2015 Asia-Pacific Microwave Conference (APMC) 3, 1-3, 2015
42015
Modeling on electromagnetic susceptibility of operational amplifier OPA694
W Zhang, Z Yan, T Kang, J Wang
2015 IEEE 6th International Symposium on Microwave, Antenna, Propagation …, 2015
42015
A Physics-Based Model for Snapback-Type ESD Protection Devices
X Yan, SM Mousavi, L Shen, Y Xu, W Zhang, S Bub, S Holland, ...
IEEE Transactions on Electromagnetic Compatibility, 2023
32023
Improvement on the accuracy of near-field scanning using tangential electric field probe
W Zhang, S Liu, X Yan, T Enomoto, H Shumiya, K Araki, C Hwang
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 370-375, 2021
32021
Electromagnetic susceptibility analysis method for 3D TSV ICs
H QIN, Z YAN, D SU, W ZHANG
北京航空航天大学学报 43 (12), 2406-2415, 2017
32017
Microwave Holography for EMI Source Imaging
X Yan, J Li, W Zhang, K Ghosh, P Sochoux, DG Beetner, V Khilkevich
IEEE Transactions on Electromagnetic Compatibility, 2023
22023
Methodology for analyzing coupling mechanisms in RFI problems based on PEEC
X Wang, A Huang, W Zhang, R Yazdani, DH Kim, T Enomoto, T Sekine, ...
IEEE Transactions on Electromagnetic Compatibility 65 (3), 761-769, 2023
22023
Electromagnetic transmit array with optical control for beamforming
W Zhang, J Meiguni, Y Sun, M Ouyang, X Yan, X Wang, R Yazdani, ...
IEEE Transactions on Antennas and Propagation 71 (6), 5481-5486, 2023
22023
3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament
R Mi, W Zhang, K Ghosh, S Walunj, Q Liu, J Rollin, P Sochoux, ...
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 266-271, 2021
22021
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