Παρακολούθηση
Yunhui Mei or Yun-Hui Mei
Yunhui Mei or Yun-Hui Mei
Tianjin Unversity and Tiangong University
Η διεύθυνση ηλεκτρονικού ταχυδρομείου έχει επαληθευτεί στον τομέα tju.edu.cn
Τίτλος
Παρατίθεται από
Παρατίθεται από
Έτος
Pressureless sintering of nanosilver paste at low temperature to join large area (≥ 100 mm2) power chips for electronic packaging
S Fu, Y Mei, GQ Lu, X Li, G Chen, X Chen
Materials Letters 128, 42-45, 2014
1302014
A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air
J Li, X Li, L Wang, YH Mei, GQ Lu
Materials & Design 140, 64-72, 2018
862018
Creep properties of low-temperature sintered nano-silver lap shear joints
X Li, G Chen, L Wang, YH Mei, X Chen, GQ Lu
Materials Science and Engineering: A 579, 108-113, 2013
832013
Transient thermal performance of IGBT power modules attached by low-temperature sintered nanosilver
G Chen, D Han, YH Mei, X Cao, T Wang, X Chen, GQ Lu
IEEE Transactions on Device and Materials Reliability 12 (1), 124-132, 2011
822011
Additive manufacturing of toroid inductor for power electronics applications
Y Yan, J Moss, KDT Ngo, Y Mei, GQ Lu
IEEE Transactions on Industry Applications 53 (6), 5709-5714, 2017
792017
Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint
G Chen, ZS Zhang, YH Mei, X Li, DJ Yu, L Wang, X Chen
Mechanics of Materials 72, 61-71, 2014
772014
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate
SY Zhao, X Li, YH Mei, GQ Lu
Microelectronics Reliability 55 (12), 2524-2531, 2015
712015
High-temperature creep behavior of low-temperature-sintered nano-silver paste films
G Chen, XH Sun, P Nie, YH Mei, GQ Lu, X Chen
Journal of electronic materials 41, 782-790, 2012
692012
Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates
Q Xu, Y Mei, X Li, GQ Lu
Journal of Alloys and Compounds 675, 317-324, 2016
662016
Reliability improvement of a double-sided IGBT module by lowering stress gradient using molybdenum buffers
M Wang, Y Mei, W Liu, Y Xie, S Fu, X Li, GQ Lu
IEEE Journal of Emerging and Selected Topics in Power Electronics 7 (3 …, 2019
652019
Simplification of low-temperature sintering nanosilver for power electronics packaging
Y Mei, G Chen, Y Cao, X Li, D Han, X Chen
Journal of electronic materials 42, 1209-1218, 2013
602013
Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250and 400in Dry Air
Y Mei, GQ Lu, X Chen, S Luo, D Ibitayo
IEEE Transactions on Device and Materials Reliability 11 (2), 316-322, 2010
592010
Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications
X Wang, Y Mei, X Li, M Wang, Z Cui, GQ Lu
Journal of Alloys and Compounds 777, 578-585, 2019
562019
Design and additive manufacturing of multipermeability magnetic cores
L Liu, C Ding, S Lu, T Ge, Y Yan, Y Mei, KDT Ngo, GQ Lu
IEEE Transactions on Industry Applications 54 (4), 3541-3547, 2018
562018
Reliability evaluation of multichip phase-leg IGBT modules using pressureless sintering of nanosilver paste by power cycling tests
S Fu, Y Mei, X Li, C Ma, GQ Lu
IEEE Transactions on Power Electronics 32 (8), 6049-6058, 2016
532016
Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly
Y Mei, G Chen, L Guo-Quan, X Chen
International journal of adhesion and adhesives 35, 88-93, 2012
502012
Rapid sintering of nano-Ag paste at low current to bond large area (> 100 mm2) power chips for electronics packaging
Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu
Journal of Materials Processing Technology 255, 644-649, 2018
482018
Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging
S Fu, Y Mei, X Li, P Ning, GQ Lu
Journal of Electronic Materials 44, 3973-3984, 2015
482015
Rapid sintering nanosilver joint by pulse current for power electronics packaging
Y Mei, Y Cao, G Chen, X Li, GQ Lu, X Chen
IEEE Transactions on Device and Materials Reliability 13 (1), 258-265, 2013
452013
Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test
X Li, G Chen, X Chen, GQ Lu, L Wang, YH Mei
Soldering & surface mount technology 24 (2), 120-126, 2012
442012
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