| First principles calculation of lattice thermal conductivity of metals considering phonon-phonon and phonon-electron scattering Y Wang, Z Lu, X Ruan Journal of applied Physics 119 (22), 2016 | 189 | 2016 |
| Metal/dielectric thermal interfacial transport considering cross-interface electron-phonon coupling: Theory, two-temperature molecular dynamics, and thermal circuit Z Lu, Y Wang, X Ruan Physical Review B 93 (6), 064302, 2016 | 76 | 2016 |
| Phonon branch-resolved electron-phonon coupling and the multitemperature model Z Lu, A Vallabhaneni, B Cao, X Ruan Physical Review B 98 (13), 134309, 2018 | 67 | 2018 |
| Effect of interlayer on interfacial thermal transport and hot electron cooling in metal-dielectric systems: An electron-phonon coupling perspective Y Wang, Z Lu, AK Roy, X Ruan Journal of Applied Physics 119 (6), 2016 | 64 | 2016 |
| Thermal conductance enhanced via inelastic phonon transport by atomic vacancies at Cu/Si interfaces Z Lu, AM Chaka, PV Sushko Physical Review B 102 (7), 075449, 2020 | 36 | 2020 |
| Edge Dislocations Induce Improved Photocatalytic Efficiency of Colored TiO2 P Ren, M Song, J Lee, J Zheng, Z Lu, M Engelhard, X Yang, X Li, ... Advanced Materials Interfaces 6 (17), 1901121, 2019 | 35 | 2019 |
| Non-Equilibrium Thermal Transport: A Review of Applications and Simulation Approaches Z Lu, X Ruan ES Energy & Environment 4, 5-14, 2019 | 28 | 2019 |
| The critical particle size for enhancing thermal conductivity in metal nanoparticle-polymer composites Z Lu, Y Wang, X Ruan Journal of Applied Physics 123 (7), 2018 | 23 | 2018 |
| Role of phonon coupling and non-equilibrium near the interface to interfacial thermal resistance: The multi-temperature model and thermal circuit Z Lu, J Shi, X Ruan Journal of Applied Physics 125 (8), 2019 | 21 | 2019 |
| Phase transformations among TiO 2 polymorphs M Song, Z Lu, D Li Nanoscale 12 (45), 23183-23190, 2020 | 19 | 2020 |
| Effect of interfacial structures on phonon transport across atomically precise Si/Al heterojunctions Z Lu, NP Smith, MP Prange, RA Bunker, JL Orrell, AM Chaka Physical Review Materials 5 (8), 086002, 2021 | 9 | 2021 |
| Atomic gradient structure alters electronic structure in 3D across the bulk and enhances photoactivity P Ren, Z Lu, M Song, J Lee, J Zheng, PV Sushko, D Li Advanced Energy Materials 11 (13), 2003548, 2021 | 7 | 2021 |
| Optimization of thermal conductance at interfaces using machine learning algorithms S Rustam, M Schram, Z Lu, AM Chaka, WS Rosenthal, J Pfaendtner ACS Applied Materials & Interfaces 14 (28), 32590-32597, 2022 | 5 | 2022 |
| Tuning Electronic Properties of 2D Materials Using Metal Adsorbates: Cu at WTe2 Edges Z Lu, MP Prange, PV Sushko The Journal of Physical Chemistry Letters 12 (28), 6596-6603, 2021 | 4 | 2021 |
| Modes of strain accommodation in Cu-Nb multilayered thin film on indentation and cyclic shear M Pole, Z Lu, TA Ajantiwalay, M Olszta, S Tripathi, A Yu, H Mehta, T Wang, ... Surfaces and Interfaces 37, 102712, 2023 | 3 | 2023 |
| Formation of pyrophosphates across grain boundaries induces the formation of mismatched but oriented interfaces in silver phosphate polypods P Ren, Z Lu, M Song, L Liu, B Wang, N Wei, ME Bowden, MG Wirth, ... Applied Surface Science 563, 149980, 2021 | 3 | 2021 |
| ES Energy & Environment HY Yu, HC Zhang, ZN Dai, XL Xia environment 19, 36, 2019 | 3 | 2019 |
| An open database of computed bulk ternary transition metal dichalcogenides SE Muller, MP Prange, Z Lu, WS Rosenthal, JA Bilbrey Scientific Data 10 (1), 336, 2023 | 2 | 2023 |
| Defect Self-Elimination in Nanocube Superlattices Through the Interplay of Brownian, van der Waals, and Ligand-Based Forces and Torques J Lee, Z Lu, Z Wu, C Ophus, GK Schenter, JJ De Yoreo, J Chun, D Li ACS nano 18 (47), 32386-32400, 2024 | | 2024 |
| High-temperature lean Cu alloys with Cr-to-Nb atomic ratio of 2 T Wang, Z Lu, Q Zhang, A Saboo, X Ma, T Liu, Z Mahbooba, J Hardin, X Li, ... Materials Today Communications 39, 108884, 2024 | | 2024 |
Xiulin RuanProfessor, School of Mechanical Engineering, Purdue UniversityΗ διεύθυνση ηλεκτρονικού ταχυδρομείου έχει επαληθευτεί στον τομέα purdue.edu