Profiles

Douglas CH Yu

Taiwan Semiconductor Manufacturing Company Ltd.

Verified email at tsmc.com

Cited by 52179

packaging 3D microelectronics interconnect semiconductor

Andre DeHon

University of Pennsylvania

Verified email at acm.org

Cited by 16717

Spatial Computing FPGAs Reconfigurable Interconnect Hardware Security

Daniel C. Edelstein

IBM

Verified email at us.ibm.com

Cited by 14892

Physics Optics Microelectronics Engineering Interconnect

N Singh

Brown University, Caterpillar Inc

Verified email at alumni.brown.edu

Cited by 9146

mechanics materials Interconnect packaging

Mohammad Hossein Moaiyeri

Associate Professor of Electronics and Computer Engineering, Shahid Beheshti University …

Verified email at sbu.ac.ir

Cited by 5500

Emerging Technologies Approximate Computing In-Memory Computing Interconnect

Xin-Ping Qu

Fudan university

Verified email at fudan.edu.cn

Cited by 4160

interconnect silicide ZnO nanoimprint

Yifei Zhang (章逸飞)

Hardware Engineer at Apple, PhD, Massachusetts Institute of Technology

Verified email at mit.edu

Cited by 3556

Physics Photonics Display Interconnect

Professor Imed Ben Dhaou

University of Turku and Dar Al-Hekma University

Verified email at utu.fi

Cited by 2227

VLSI for DSP low-power design embedded system design for IoT approximated computing Interconnect

Sang Won Kim

Samsung Advanced Institute of Technology

Verified email at samsung.com

Cited by 2123

2D Materials Monolithic 3D Interconnect

Arkadiy Morgenshtein

Medtronic (Given Imaging), Technion

Verified email at technion.ac.il

Cited by 2012

VLSI low-power circuits interconnect

1 - 10