Douglas C.H. Yu

Douglas CH Yu

Taiwan Semiconductor Manufacturing Company Ltd.
Verified email at tsmc.com
Cited by 52025
packaging 3D microelectronics interconnect semiconductor
Rafael Auras

Rafael Auras

Professor, School of Packaging, Michigan State University
Verified email at msu.edu
Cited by 24306
poly(lactic acid) packaging biodegradation life cycle assessment ecodesign
joy laskar

joy laskar

georgia tech, majasystems
Verified email at majasystems.com
Cited by 17684
electrical engineering rf mmW packaging
Madhusudan K Iyengar

Madhusudan K Iyengar

Google
Verified email at google.com
Cited by 17660
computer architecture thermal management data centers packaging energy efficiency
SUBRAMANIAN S. IYER

SUBRAMANIAN S. IYER

University of California at Los Angeles,
Verified email at g.ucla.edu
Cited by 17369
Microelectronics System Integration Packaging neuromorphic computing
jone carter

jone carter

Cited by 15409
packaging
L-T. Lim

LT. Lim

Department of Food Science, University of Guelph
Verified email at uoguelph.ca
Cited by 15177
film fiber packaging food electrospinning
Tadatomo Suga

Tadatomo Suga

Meisei University
Verified email at gakushikai.jp
Cited by 15107
bonding packaging interface integration
Rick Schifferstein

Rick Schifferstein

Associate Professor TU Delft
Verified email at tudelft.nl
Cited by 13970
Food Design Eating behaviour Packaging Experience
Pierre Chandon

Pierre Chandon

L'Oréal Chaired Professor of Marketing, INSEAD
Verified email at insead.edu
Cited by 13745
marketing consumer behavior nudging food packaging
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