Shang Y. Hou 侯上勇

Shang Y. Hou 侯上勇

台灣積體電路有限公司
Verified email at ms9.hinet.net
Cited by 13140
Semiconductor packaging 3DIC
Hak-Sung Kim

Hak-Sung Kim

Mechanical Engineering, Hanyang University
Verified email at hanyang.ac.kr
Cited by 9016
Composite Printed electronics Light sintering technology Semiconductor packaging Nanocomposite
Youngsuk Nam

Youngsuk Nam

Associate Professor, Dept. of Mechanical Engineering at KAIST
Verified email at kaist.ac.kr
Cited by 7436
Phase change Heat transfer Semiconductor packaging Data center cooling Thermal materials
Niranjan Parab

Niranjan Parab

Intel corp.
Verified email at intel.com
Cited by 6066
Additive manufacturing Dynamic behavior of materials Brittle fracture Laser powder bed fusion semiconductor packaging
Michael Mack

Michael Mack

Luxtera, Inc.
Verified email at luxtera.com
Cited by 5260
Photonics LEDs Lasers Semiconductor Packaging
Le Cai (蔡乐)

Le Cai (蔡乐)

Meta Reality Labs-Research
Verified email at meta.com
Cited by 5199
TFT Flexible/Stretchable Hybrid Electronics Micro/Nano Fab Semiconductor Packaging
shintaro yamamichi

shintaro yamamichi

IBM Research -Tokyo
Verified email at jp.ibm.com
Cited by 4066
Semiconductor packaging AI Hardware Quantum Material Informatics
Bharathi M S

Bharathi MS

Institute of High Performance Computing
Verified email at ihpc.a-star.edu.sg
Cited by 3289
Thin film growth growth of 2D materials Semiconductor Packaging Nonlinear dynamics Multiscale Modeling
Yonghao Xiu

Yonghao Xiu

Apple
Verified email at apple.com
Cited by 3215
Polymer Surface physics Optical devices Semiconductor packaging
Stephanie Butler

Stephanie Butler

Technology Innovation Architect
Verified email at wattsbutler.com
Cited by 2864
power semiconductors advanced process control semiconductor packaging wide bandgap
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