Loading...
The system can't perform the operation now. Try again later.
Articles
Case law
Profiles
My profile
My library
Metrics
Alerts
Settings
Get journal articles
Get journal articles
Profiles
My profile
My library
Preetam Chandan Mohapatra
Senior Packaging R&D Engineer, Intel Corporation
Verified email at intel.com
Cited by 488
Semiconductor Packing
Electronic & Piezoelectric Materials
Polymers Adhesives
Composite Materials
FEA
Privacy
Terms
Help
About Scholar
Search help