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- Yilu ZHAO (赵怡潞)Harbin Institute of TechnologyVerified email at hit.edu.cn
- JH LUAN (栾军华)City University of Hong KongVerified email at cityu.edu.hk
- Z.B. JiaoHong Kong Polytechnic UniversityVerified email at mit.edu
- Da ChenSoutheast UniversityVerified email at seu.edu.cn
- Weihong Liu(刘卫红)Harbin Institute of Technology (Shenzhen)Verified email at hit.edu.cn
- H. J. Kong (江豪杰)Dongguan University of Technology; City University of Hong KongVerified email at my.cityu.edu.hk
- Jacob Chiching HuangCity University of Hong KongVerified email at cityu.edu.hk
- Tianlong Zhang(张天隆)Hong Kong University of Science and Technology, Assistant Professor of MAEVerified email at ust.hk
- Alice HuAssociate Professor, City University of Hong KongVerified email at cityu.edu.hk
- Yang TongInstitute for Advanced Studies in Precision Materials, Yantai UniversityVerified email at ytu.edu.cn
- Peter LiawUniversity of TennesseeVerified email at utk.edu
- Bin Han (韩斌)Shaanxi University of Science and Technology, Xi'an, ChinaVerified email at sust.edu.cn
- Shijun Zhao (趙仕俊)City University of Hong KongVerified email at cityu.edu.hk
- Weiwei Xu (许伟伟)Assistant professor, Xiamen UniversityVerified email at xmu.edu.cn
- Du XHprofessor of MSE, Shenyang aerospace universityVerified email at cityu.edu.hk
- Jian Lu (吕坚)Dean of College of Engineering, Chair Professor, City University of Hong KongVerified email at cityu.edu.hk
- Yiran LiShanghai UniversityVerified email at shu.edu.cn
- Yasuo ShimizuSony Semiconductor Solutions CorporationVerified email at sony.com
- Feng HeNorthwestern Polytechnical UniversityVerified email at mail.nwpu.edu.cn
- Zhe Jia (贾喆)Southeast UniversityVerified email at seu.edu.cn