| Atomistic analysis of the thermomechanical properties of Sn–Ag–Cu solder materials at the nanoscale with the MEAM potential M Motalab, R Paul, S Saha, S Mojumder, T Ahmed, JC Suhling Journal of molecular modeling 25, 1-10, 2019 | 25 | 2019 |
| Interface dislocations and grain boundary disconnections using Smith normal bicrystallography NC Admal, T Ahmed, E Martinez, G Po Acta Materialia 240, 118340, 2022 | 15 | 2022 |
| Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint JCS MD. Tusher Ahmed, Mohammad Motalab Journal of Electronic Materials, 2020 | 15* | 2020 |
| Strain-driven faceting of graphene-catalyst interfaces M Surana, G Ananthakrishnan, MM Poss, JJ Yaacoub, K Zhang, T Ahmed, ... Nano letters 23 (5), 1659-1665, 2023 | 5 | 2023 |
| Bicrystallography-informed Frenkel–Kontorova model for interlayer dislocations in strained 2D heterostructures MT Ahmed, C Wang, AS Banerjee, NC Admal Mechanics of Materials 190, 104903, 2024 | 3 | 2024 |
| Interface mechanics of 2D materials on metal substrates M Surana, T Ahmed, NC Admal Journal of the Mechanics and Physics of Solids 163, 104831, 2022 | 2 | 2022 |
| Combined experimental and numerical investigation of energy harness utilizing vortex induced vibration over half cylinder using piezoelectric beams MT Ahmed, MT Hossain, MA Rahman AIP Conference Proceedings 1851 (1), 2017 | 2 | 2017 |
| Quantifying superlubricity of bilayer graphene from the mobility of interface dislocations MT Ahmed, M Choi, HT Johnson, NC Admal arXiv preprint arXiv:2501.05328, 2025 | | 2025 |
| Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint subjected to random vibration MA Motalab, MT Ahmed, MO Bappy AIP Conference Proceedings 2324 (1), 2021 | | 2021 |
| Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects T Ahmed, M Motalab, JC Suhling International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | | 2019 |
| Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint MT Ahmed Department of Mechanical Engineering, 2019 | | 2019 |
| Investigation on thermal cycling life prediction of PBGA microprocessor components with wavy patterned interface layer MT Hossain, MT Ahmed, M Motalab, AS Shakil, M Kamruzzaman AIP Conference Proceedings 1980 (1), 2018 | | 2018 |
Mohammad Tanver HossainPhD candidate at University of Illinois Urbana-Champaign, Former Lecturer of Mechanical EngineeringVerified email at illinois.edu